Molecular dynamics simulation of thermal cycling test in electronic packaging

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 35-40

  Fan, Hai Bo ^a   Chan, Edward K L ^a   Wong, Cell K Y ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Cuprous oxide content; Delamination; Interfacial adhesion; Molecular dynamics; Thermal cycling

Indexed keywords

ADHESION; COMPUTER SIMULATION; DELAMINATION; EPOXY RESINS; INTERFACIAL ENERGY; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; THERMAL CYCLING;

CUPROUS OXIDE CONTENT; ELECTRONIC ASSEMBLIES; EPOXY MOLDING COMPOUND (EMC); INTERFACIAL ADHESION;

ELECTRONICS PACKAGING;

EID: 38749134842     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429707     Document Type: Article

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