Nanosoldering carbon nanotube junctions by local chemical vapor deposition for improved device performance

Nano Letters

Volumn 13, Issue 12, 2013, Pages 5844-5850

  Do, Jae Won ^a   Estrada, David ^a,c   Xie, Xu ^a   Chang, Noel N ^b   Mallek, Justin ^b   Girolami, Gregory S ^b   Rogers, John A ^a,b   Pop, Eric ^a,b,d   Lyding, Joseph W ^a,b  

^a University of Illinois at Urbana Champaign   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c Boise State University   (United States)

^d Stanford University   (United States)

Author keywords

Carbon nanotubes (CNT); electrical resistance; intertube junctions; local chemical vapor deposition (CVD); nanosoldering; thermal resistance

Indexed keywords

CARBON NANOTUBE JUNCTIONS; CARBON NANOTUBE NETWORK; CHEMICAL VAPOR DEPOSITIONS (CVD); DEVICE PERFORMANCE; ELECTRICAL RESISTANCES; NANOSOLDERING; NANOTUBE JUNCTIONS; ON/OFF CURRENT RATIO;

CARBON NANOTUBES; HEAT RESISTANCE; NANOTECHNOLOGY; SEMICONDUCTOR JUNCTIONS; VAPORS;

CHEMICAL VAPOR DEPOSITION;

CARBON NANOTUBE; METAL;

ARTICLE; CHEMISTRY; NANOTECHNOLOGY; SURFACE PROPERTY; TEMPERATURE;

METALS; NANOTECHNOLOGY; NANOTUBES, CARBON; SURFACE PROPERTIES; TEMPERATURE;

EID: 84890380282     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl4026083     Document Type: Article

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