Tailored dielectric properties of high-k polymer composites via nanoparticle surface modification for embedded passives applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1033-1039

  Lu, Jiongxin ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); DIELECTRIC LOSSES; NANOPARTICLES; PERMITTIVITY; POLYMER MATRIX; PRINTED CIRCUIT BOARDS; SURFACE TREATMENT;

PERCOLATION THRESHOLD; POLYMER CONDUCTIVE FILLER COMPOSITES; PROCESS COMPATIBILITY;

CONDUCTING POLYMERS;

EID: 35348840196     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373924     Document Type: Conference Paper

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