Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Journal of Electronic Materials

Volumn 33, Issue 11, 2004, Pages 1326-1330

  Dong, Hai ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Embedded atom method (EAM); Molecular dynamics (MD); Nano lead free solder

Indexed keywords

COALESCENCE; COMPUTER SIMULATION; COPPER; DEPOSITION; ELECTRONICS INDUSTRY; HIGH TEMPERATURE EFFECTS; LEAD ALLOYS; MOLECULAR DYNAMICS; SOLDERING ALLOYS; SUBSTRATES;

DEGREE OF COLLAPSING; EMBEDDED ATOM METHOD (EAM); NANO LEAD-FREE SOLDERS;

NANOSTRUCTURED MATERIALS;

EID: 10044235125     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0161-3     Document Type: Conference Paper

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