SCOPUS 정보 검색 플랫폼

Journal of Adhesion Science and Technology

Volumn 19, Issue 2, 2005, Pages 87-94

Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications

(3) Dong, Hai a Zhang, Zhuqing a Wong, C P a

a Georgia Institute of Technology (United States)

Author keywords

Computer simulation; Conductive adhesive; Embedded atom method; Molecular dynamics

Indexed keywords

ADHESIVES; ANISOTROPY; BINDERS; COMPOSITE MATERIALS; COMPUTATIONAL METHODS; COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; EUTECTICS; LARGE SCALE SYSTEMS; MOLECULAR DYNAMICS; PRINTED CIRCUIT BOARDS; THERMAL EFFECTS; TIN ALLOYS; TOXICITY; ADHESIVE JOINTS; COPPER; POTENTIAL ENERGY; SPHERES;

CONDUCTIVE ADHESIVES; EMBEDDED ATOM METHOD; EUTECTIC SOLDERS; MOLECULAR DYNAMICS (MD) SIMULATION;

JOINTS (STRUCTURAL COMPONENTS); MOLECULAR DYNAMICS;

ANISOTROPIC CONDUCTIVE ADHESIVES; APPLIED STRAIN; COMPRESSIVE STRAIN; CONDUCTIVE ADHESIVE; COPPER SUBSTRATES; EMBEDDED-ATOM METHOD; LEAD-FREE; MOLECULAR DYNAMICS SIMULATIONS; PAIR CORRELATION FUNCTIONS; POTENTIAL ENERGY CURVES; STRUCTURE EVOLUTION;

EID: 14844350993 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/1568561053148430 Document Type: Article

Times cited : (8)

References (11)

1
- 0033747819
- M. Abtew and G. Selvaduray, Mater. Sci. Eng. R: Rep. 27, 95-141 (2000).
- (2000) Mater. Sci. Eng. R: Rep. , vol.27 , pp. 95-141
- Abtew, M.¹ Selvaduray, G.²

2
- 0003512080
- Electrochemical Publications, Bristol
- J. Liu (Ed.), Conductive Adhesives for Electronics Packaging, Electrochemical Publications, Bristol (1999).
- (1999) Conductive Adhesives for Electronics Packaging
- Liu, J.¹

3
- 0032092179
- S. Kotthaus, R. Haug, H. Schafer and O. Hennemann, IEEE Trans. CPMT, Part A 21, 259-265 (1998).
- (1998) IEEE Trans. CPMT, Part A , vol.21 , pp. 259-265
- Kotthaus, S.¹ Haug, R.² Schafer, H.³ Hennemann, O.⁴

4
- 0034196998
- Y. Shimada, D. Lu and C. P. Wong, J. Electr. Manuf. 10, 97-103 (2000).
- (2000) J. Electr. Manuf. , vol.10 , pp. 97-103
- Shimada, Y.¹ Lu, D.² Wong, C.P.³

5
- 0022807030
- G. L. Allen, R. A. Bayles, W. W. Gile and W. A. Jesser, Thin Solid Films 144, 297-308 (1986).
- (1986) Thin Solid Films , vol.144 , pp. 297-308
- Allen, G.L.¹ Bayles, R.A.² Gile, W.W.³ Jesser, W.A.⁴

6
- 0036373993
- M. Oda, T. Abe, T. Suzuki, N. Saito, H. Iwashige and G. Kutluk, Mater. Res. Soc. Symp. Proc. 704, 3-10 (2002).
- (2002) Mater. Res. Soc. Symp. Proc. , vol.704 , pp. 3-10
- Oda, M.¹ Abe, T.² Suzuki, T.³ Saito, N.⁴ Iwashige, H.⁵ Kutluk, G.⁶

7
- 10444273187
- K. S. Moon, H. Dong, S. Pothukuchi, Y. Li and C. P. Wong, in: Proceedings of the 54th Electronic Components and Technology Conference, pp. 1983-1988 (2004).
- (2004) Proceedings of the 54th Electronic Components and Technology Conference , pp. 1983-1988
- Moon, K.S.¹ Dong, H.² Pothukuchi, S.³ Li, Y.⁴ Wong, C.P.⁵

8
- 4244079381
- M. S. Daw and M. I. Baskes, Phys. Rev. B 29, 6443-6453 (1984).
- (1984) Phys. Rev. B , vol.29 , pp. 6443-6453
- Daw, M.S.¹ Baskes, M.I.²

9
- 4244024430
- M. S. Daw and M. I. Baskes, Phys. Rev. Lett. 50, 1285-1288 (1983).
- (1983) Phys. Rev. Lett. , vol.50 , pp. 1285-1288
- Daw, M.S.¹ Baskes, M.I.²

10
- 0032649357
- R. Ge, P. C. Clapp and J. A. Rifkin, Surf. Sci. 426, L413-L419 (1999).
- (1999) Surf. Sci. , vol.426
- Ge, R.¹ Clapp, P.C.² Rifkin, J.A.³

11
- 0027268763
- S. J. Plimpton and B. A. Hendrickson, Mater. Res. Soc. Symp. Proc. 291, 37-42 (1993).
- (1993) Mater. Res. Soc. Symp. Proc. , vol.291 , pp. 37-42
- Plimpton, S.J.¹ Hendrickson, B.A.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.