Wettability of molten Sn-Bi-Cu solder on Cu substrate

Materials Letters

Volumn 63, Issue 23, 2009, Pages 2067-2069

  Zang, Likun ^a,c,d   Yuan, Zhangfu ^a,b   Zhao, Hongxin ^a,d   Zhang, Xiaorui ^a,d  

^a INSTITUTE OF PROCESS ENGINEERING   (China)

^b PEKING UNIVERSITY   (China)

^c UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^d UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Electronic materials; Intermetallic compound; Metals and alloys; Wettability

Indexed keywords

CU SUBSTRATE; ELECTRONIC MATERIALS; EXPONENTIAL RULE; INTERMETALLIC COMPOUND; METALS AND ALLOYS; PB FREE SOLDERS; SESSILE DROP METHOD; TEMPERATURE RANGE; THREE STAGES; WETTABILITY; WETTING BEHAVIOR;

BRAZING; CONTACT ANGLE; COPPER ALLOYS; LEAD; METALLURGY; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; WELDING; WETTING;

TIN;

EID: 67651014411     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.06.052     Document Type: Article

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