Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1821-1826

  Yoon, Jeong Won ^a   Lee, Chang Bae ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Activation energy; Growth kinetics; Intermetallic compound; Time exponent(n); Tin 58bismuth solder

Indexed keywords

ACTIVATION ENERGY; COPPER COMPOUNDS; EUTECTICS; GROWTH KINETICS; INTERMETALLICS; SURFACE REACTIONS; TIN ALLOYS;

EUTECTIC SOLDERS;

SOLDERING ALLOYS;

EID: 0036699289     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1821     Document Type: Article

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