High-performance light-emitting diodes encapsulated with silica-filled epoxy materials

ACS Applied Materials and Interfaces

Volumn 5, Issue 18, 2013, Pages 8968-8981

  Li, Tian ^a   Zhang, Jie ^a   Wang, Huiping ^a   Hu, Zhongnan ^a   Yu, Yingfeng ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

device reliability; epoxy packaging materials; fillers; light emitting diodes

Indexed keywords

DEVICE RELIABILITY; DYNAMIC MECHANICAL ANALYSIS (DMA); EVALUATION METHODS; LIGHT TRANSMITTANCE; PERFORMANCE AND RELIABILITIES; SCANNING ACOUSTIC MICROSCOPY; THERMOMECHANICAL ANALYZERS; WATER DIFFUSION COEFFICIENTS;

DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; DIODES; DYNAMIC MECHANICAL ANALYSIS; FAILURE (MECHANICAL); FILLERS; FUSED SILICA; MOISTURE; PACKAGING MATERIALS; QUARTZ; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILICATE MINERALS; SILICONES; SORPTION; SPHERES; THERMAL AGING; THERMOGRAVIMETRIC ANALYSIS;

LIGHT EMITTING DIODES;

EID: 84885060052     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am402035r     Document Type: Article

References (49)

1. Chang, M. H.; Das, D.; Varde, P. V.; Pecht, M. Microelectron. Reliab. 2012, 52, 762-782
2. Gao, N.; Liu, W.; Ma, S.; Tang, C.; Yan, Z. J. Polym. Res. 2012, 19, 9923
3. Huang, J. C.; Chu, Y.-P.; Wei, M.; Deanin, R. D. Adv. Polym. Technol. 2004, 23, 298-306
4. Lin, Y. C.; Tran, N.; Zhou, Y.; He, Y.; Shi, F. G. Materials challenges and solutions for the packaging of high power LEDs. Microsystems, Packaging, Assembly Conference Taiwan, Taipei, 2006; IEEE.
5. Tsuchida, S.; Osaka, M. Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition. U.S. Patent 5,985,954, November 16, 1999.
6. Chu, Y. P. Epoxy resin systems for light-emitting diode. Master, University of Massachusetts Lowell, 2003.
7. Yasumasa, M. UV-resistant epoxy resin, and light emitting diode or wavelength conversion element sealed by using the epoxy resin. JP 2003-012896, January 15, 2003.
8. Lin, Y. C. Materials for optoelectronic device packaging/manufacturing. Ph.D., University of California, Irvine, 2007.
9. Zhou, Y. Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices. Ph.D, University of California, Irvine, 2008.
10. Wong, C. P.; Wong, M. M. IEEE Trans. Compon. Packag. Technol. 1999, 22, 21-25
11. Pecht, M. G.; Govind, A. IEEE Trans. Compon., Packag., Manuf. Technol., Part C. 1997, 20, 207-212
12. Groothuis, S. K.; Heinen, K. G.; Rimpillo, L. Effects of mold compound material properties on solder reflow package cracking. Reliability Physics Symposium, 1995. 33rd Annual Proceedings, IEEE International, 1995; IEEE.
13. Hu, J.; Yang, L.; Whan Shin, M. Microelectron. J. 2007, 38, 157-163
14. Lantz, L.; Hwang, S.; Pecht, M. Microelectron. Reliab. 2002, 42, 1163-1170
15. Ma, X.; Jansen, K. M. B.; Ernst, L. J.; van Driel, W. D.; van der Sluis, O.; Zhang, G. Q. Microelectron. Reliab. 2007, 47, 1685-1689
16. Maggana, C.; Pissis, P. J. Polym. Sci., Part B: Polym. Phys. 1999, 37, 1165-1182
17. Fan, J. J.; Yung, K. C.; Michael, P. IEEE Trans. Device Mater. Reliab. 2011, 11, 407-416
18. Olmos, D.; Martínez, F.; González-Gaitano, G.; González-Benito Eur. Polym. J. 2011, 47, 1495-1502
19. Brian, J. T.; Barry, B.; Christy, M. Underfills, Adhesives and Coatings in Electronics Assemblies. In Electronic Materials and Processes Handbook, 3 rd ed.; Charles, A. H., Ed.; McGraw-Hill Professional: New York, 2004; Vol. 9, pp 573-633.
20. Gerard, K. An Introduction to Plastic Packaging. The simulation of thermomechanically induced stress in plastic encapsulated IC packages; Kluwer Academic Publishers: Dordrecht, 1999; Vol. 1, pp 1-12.
21. Kinjo, N.; Ogata, M.; Nishi, K.; Kaneda, A. Epoxy molding compounds as encapsulation materials for microelectronic devices. In Speciality Polymers/Polymer Physics; Berry, G. C.; Matyjaszewski, K., Eds.; Advances in Polymer Science 88; Springer Berlin Heidelberg: Berlin, 1989; pp 1-48.
22. Kanaji, K.; Mizuike, K.; Nishiguchi, T. High performance liquid epoxy encapsulant for advanced semiconductor package. Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st, 1997; IEEE.
23. Fujii, A.; Andoh, M.; Yamamoto, I.; Ibuki, H.; Uchida, K.; Yoshizumi, A. New epoxy molding compounds for SMT with pre-plated lead-frame system. Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT, 1998; IEEE.
24. Yorkgitis, E. M.; Eiss, N. S.; Tran, C.; Wilkes, G. L.; McGrath, J. E. Adv. Polym. Sci. 1985, 72, 79-109
25. Nakamura, Y.; Tabata, H.; Suzuki, H.; Iko, K.; Okubo, M.; Matsumoto, T. J. Appl. Polym. Sci. 1986, 32, 4865-4871
26. Ho, T. H.; Wang, C. S. Eur. Polym. J. 2001, 37, 267-274
27. Tuller, H. W.; Nussbaum, R. W. Encapsulant compositions based on anhydride-hardened epoxy resins. U.S. Patent 4,042,550, August 16, 1977.
28. Wong, C.; McBride, R. IEEE Trans. Adv. Packag. 1993, 16, 868-875
29. Müller, R.; Heckmann, K.; Habermann, M.; Paul, T.; Stratmann, M. J. Adhes. 2000, 72, 65-83
30. Suzuki, O.; Kawamoto, S. Development of Low Stress No-Flow Underfill for Flip-Chip Application. Electronic Components and Technology Conference, 2005; IEEE.
31. Du, X.; Xie, G.; Tan, W.; Qin, S.; Cheng, X. Stress Reduction of Epoxy Molding Compound and Its Effect on Delamination. High Density packaging and Microsystem Integration, 2007. HDP'07. International Symposium on, 2007; IEEE.
32. Mont, F. W.; Kim, J. K.; Schubert, M. F.; Schubert, E. F.; Siegel, R. W. J. Appl. Phys. 2008, 103, 083120
33. Chung, P. T.; Yang, C. T.; Wang, S. H.; Chen, C. W.; Chiang, A. S. T.; Liu, C. Y. Mater. Chem. Phys. 2012, 136, 868-876
34. Kazuhiro, F.; Shinya, O. Epoxy Resin Composition for Optical- Semiconductor Element Encapsulation and Optical-Semiconductor Device Using the Same. U.S. Patent 2011/0272829, November 10, 2011.
35. Ota, S.; Fuke, K.; Goto, C.; Ito, H.; Taniguchi, T.; Yoshida, K.; Gunji, M.; Takuwa, S. Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same. U.S. Patent 7,986,050, July 26, 2011.
36. Rubinsztajn, M. I.; Rubinsztajn, S. Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst. U.S. Patent 6,632,892, October 14, 2003.
37. Yeager, G. W.; Rubinsztajn, M. I. Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst. U.S. Patent 6,617,400, September 9, 2003.
38. Huang, J. C.; Chu, Y. P.; Wei, M.; Deanin, R. D. Adv. Polym. Technol. 2004, 23, 298-306
39. Blank, W. J.; He, Z. A.; Picci, M. J. Coat. Technol. 2002, 74, 33-41
40. Morita, Y. J. Appl. Polym. Sci. 2009, 114, 2301-2306
41. Akatsuka, M.; Takezawa, Y.; Amagi, S. Polymer 2001, 42, 3003-3007
42. Trevisanello, L.; Meneghini, M.; Mura, G.; Vanzi, M.; Pavesi, M.; Meneghesso, G.; Zanoni, E. IEEE Trans. Device Mater. Reliab. 2008, 8, 304-311
43. Wong, E.; Chan, K.; Rajoo, R.; Lim, T. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging. Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000; IEEE.
44. Park, G. S. Diffusion in Polymers; Academic Press: New York, 1968.
45. Li, L.; Yu, Y. F.; Wu, Q. L.; Zhan, G. Z.; Li, S. J. Corros. Sci. 2009, 51, 3000-3006
46. Li, L.; Yu, Y. F.; Su, H. H.; Zhan, G. Z.; Li, S. J.; Wu, P. Y. Appl. Spectrosc. 2010, 64, 458-465
47. Imaz, J. J.; Rodriguez, J. L.; Rubio, A.; Mondragon, I. J. Mater. Sci. Lett. 1991, 10, 662-665
48. Teh, P. L.; Jaafar, M.; Akil, H. M.; Seetharamu, K. N.; Wagiman, A. N. R.; Beh, K. S. Polym. Adv. Technol. 2008, 19, 308-315
49. Lin, L. L.; Ho, T. H.; Wang, C. S. Polymer 1997, 38, 1997-2003