Stress reduction of epoxy molding compound and its effect on delamination

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Xinyu, Du ^a   Guangchao, Xie ^a   Wei, Tan ^a   Suqiong, Qin ^a   Xingming, Cheng ^a  

^a HUAWEI TECHNOLOGIES CO LTD   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); DELAMINATION; SEMICONDUCTOR MATERIALS; SHEET MOLDING COMPOUNDS;

EPOXY MOLDING COMPOUND; STRESS INDEX;

ELECTRONICS PACKAGING;

EID: 41049105109     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283560     Document Type: Conference Paper

References (4)

1. Lin, T.Y.., Fang, C.M., Yao, Y.F., and Chua, K. H. "Development of the Green Plastic Encapsulation for High Density Wirebonded Leaded Packages," Microelectronics Reliability 43 (2003) pp. 811-817
2. Kenner,V., Harper,B. ,and Itkin,V., "Stress Relaxtion in Molding Compounds, " Journal of Electronic Materials ,Vol.26, No.7 (1997), pp.821-826
3. Ru. C.Q "Stress Analysis of Thernal Inclusions With Interior Voids and Crhacks, " Tanssactrions of ASME. Vol 22, (2000), pp. 192-199.
4. Kelly,G., "The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages," Kluwer Academic Publishers. (Boston, 1999)