Mechanism and thermal effect of delamination in light-emitting diode packages

Microelectronics Journal

Volumn 38, Issue 2 SPEC. ISS., 2007, Pages 157-163

  Hu, Jianzheng ^a   Yang, Lianqiao ^a   Whan Shin, Moo ^a  

^a Myong Ji University   (South Korea)

Author keywords

Delamination; Light emitting diode; Thermal resistance; Thermo mechanical stress

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; HEAT RESISTANCE; MOISTURE; STRESS CONCENTRATION; THERMAL EFFECTS;

HEAT BLOCK TESTING; HYGRO-MECHANICAL STRESSES; TRANSIENT THERMAL MEASUREMENTS;

LIGHT EMITTING DIODES;

EID: 33846576199     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.08.001     Document Type: Article

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