Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Polymers for Advanced Technologies

Volumn 19, Issue 4, 2008, Pages 308-315

  Teh, P L ^a   Jaafar, M ^a   Akil, H M ^a   Seetharamu, K N ^b   Wagiman, A N R ^c   Beh, K S ^c  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

^b M S RAMAIAH UNIVERSITY OF APPLIED SCIENCES   (India)

^c Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

Composites; Electronic packaging; Epoxy; Particle fillers

Indexed keywords

BENDING STRENGTH; ELECTRONICS PACKAGING; FILLERS; FRACTURE TOUGHNESS; FUSED SILICA; GLASS; THERMAL EXPANSION;

EPOXY COMPOSITES; PARTICLE FILLERS;

COMPOSITE MATERIALS;

BENDING STRENGTH; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; FILLERS; FRACTURE TOUGHNESS; FUSED SILICA; GLASS; THERMAL EXPANSION;

COMPOSITE; STIFFNESS; STRENGTH; THERMAL EXPANSION; TOUGHNESS;

EID: 42149114617     PISSN: 10427147     EISSN: 10991581     Source Type: Journal    
DOI: 10.1002/pat.1014     Document Type: Article

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