Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing

Microelectronics Reliability

Volumn 42, Issue 8, 2002, Pages 1163-1170

  Lantz, Leon ^a   Hwang, Seongdeok ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CROSSLINKING; ELECTRIC CONDUCTIVITY; ELECTRODES; ENCAPSULATION; EPOXY RESINS; FAILURE ANALYSIS; FRACTURE TOUGHNESS; GLASS TRANSITION; MOISTURE; PLASTICS MOLDING; POLYBUTADIENES; RELIABILITY THEORY; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

PLASTIC ENCAPSULANT MATERIALS (PEM);

ELECTRONICS PACKAGING;

EID: 0036681785     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00091-4     Document Type: Article

References (20)

1. Epoxy molding compounds as encapsulation materials for microelectronic devices
2. Powdered epoxy resin test methods
3. Advances in epoxy molding compounds
4. Role of fillers/reinforcements in thermosetting molding compounds
5. Gold-aluminum bond failure induced by halogenated additives in epoxy molding compounds
6. Molding compound trends in a denser packaging world: Qualification tests and reliability concerns
7. Popcorning in PBGA packages during IR reflow soldering
8. Spiral flow modelling of a filled epoxy-novolac molding compound
9. Effects of die coatings, mold compounds, and test conditions on temperature cycling failures
10. Thermal degradation of epoxy novolac-phenol formaldehyde novolac resin systems
11. Moisture transport phenomena in epoxies for microelectronics applications
12. A method to predict cracking in IC plastic packages
13. Effect of mold compound components on moisture-induced degradation of gold-aluminum bonds in epoxy encapsulated devices
14. IC failure analysis: Techniques and tools for quality and reliability improvement