Characterization of moisture properties of polymers for IC packaging

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1685-1689

  Ma, Xiaosong ^a   Jansen, K M B ^a   Ernst, L J ^a   van Driel, W D ^b,c   van der Sluis, O ^a   Zhang, G Q ^a,b,c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; DIFFUSION; EPOXY RESINS; INTEGRATED CIRCUITS; MOISTURE; SILICA;

EPOXY MOLDING COMPOUNDS; MOISTURE ABSORPTION EQUILIBRIUM;

ELECTRONICS PACKAGING;

EID: 34548661296     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.090     Document Type: Article

References (5)

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2. Tee T.Y., and Zhong Z. Integrated vapour pressure, hygroswelling, and thermo-mechanical stress modelling of QFN package during reflow with interface fracture mechanics analysis. Microelectron Reliab 44 (2004) 105-114
3. Lee K.C., Vythilingam A., and Alpern P. A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. Microelectron Reliab 45 (2005) 1668-1671
4. Merdas I., Thominette F., Tcharkhtchi A., and Verdu J. Factors governing water absorption by composite matrices. Compos Sci Technol 62 (2002) 487-492
5. Nogueira P., et al. Effect of water sorption on the structure and mechanical properties of an epoxy resin system. J Appl Polym Sci 80 (2001) 71-80