Flexible substrate and release layer for flexible MEMS devices

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 31, Issue 5, 2013, Pages

  Ahmed, Moinuddin ^a   Butler, Donald P ^a  

^a University of Texas at Arlington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER WAFERS; COMMON SOLVENTS; FABRICATION EQUIPMENT; FLEXIBLE SUBSTRATE; HIGH-GLASS TRANSITION TEMPERATURES; MEMS FABRICATION TECHNIQUES; SILICON CARRIERS; WAFER CLEANING;

FABRICATION; GLASS; GLASS TRANSITION; MICROSYSTEMS; SUBSTRATES;

SILICON WAFERS;

EID: 84884946124     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.4816938     Document Type: Article

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