Development of anti-wear and anti-bacteria TaN-(Ag,Cu) thin films - A review

Surface and Coatings Technology

Volumn 233, Issue , 2013, Pages 159-168

  Hsieh, J H ^a   Chiu, C H ^b,c   Li, C ^d   Wu, W ^e   Chang, S Y ^e  

^a MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b CHANG GUNG MEMORIAL HOSPITAL   (Taiwan)

^c CHANG GUNG UNIVERSITY   (Taiwan)

^d NATIONAL YANG MING UNIVERSITY   (Taiwan)

^e NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Anti wear; Antibacteria; Nanocomposite thin films; TaN (Ag,Cu); TaN Ag; TaN Cu

Indexed keywords

ANTI-BACTERIA; ANTI-WEAR; NANOCOMPOSITE THIN FILMS; TAN-(AG,CU); TAN-AG; TAN-CU;

BACTERIA; COPPER; DIFFUSION; METAL IONS; METALLIC MATRIX COMPOSITES; NANOCOMPOSITE FILMS; RAPID THERMAL ANNEALING; SILVER ALLOYS; THIN FILMS; TRIBOLOGY; WEAR RESISTANCE;

SILVER;

EID: 84884417470     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2013.05.013     Document Type: Review

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