Dissolution of Cu nanoparticles and antibacterial behaviors of TaN-Cu nanocomposite thin films

Thin Solid Films

Volumn 517, Issue 17, 2009, Pages 4956-4960

  Liu, P C ^a   Hsieh, J H ^a   Li, C ^b   Chang, Y K ^a   Yang, C C ^a  

^a MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Antibacterial efficiency; Nanocomposite thin film; Nanoparticle; TaN Cu

Indexed keywords

ANNEALING CONDITION; ANTI-BACTERIAL BEHAVIORS; ANTI-WEAR; ANTIBACTERIAL EFFICIENCY; ANTIBACTERIAL FUNCTIONS; ANTIBACTERIAL PERFORMANCE; ANTIBACTERIAL PROPERTIES; CU NANOPARTICLES; DISSOLVING BEHAVIOR; GALVANIC EFFECT; LONG TERM; NANO-SIZED; NANOCOMPOSITE THIN FILM; NANOCOMPOSITE THIN FILMS; SIZE EFFECTS; TAN-CU;

COPPER POWDER METALLURGY; DISSOLUTION; NANOCOMPOSITES; NANOPARTICLES; PARTICLE SIZE; POWDERS; TANNING; TANTALUM COMPOUNDS; THIN FILM DEVICES; THIN FILMS;

COPPER;

EID: 65649141667     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.03.109     Document Type: Article

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