Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

Vacuum

Volumn 87, Issue , 2013, Pages 160-163

  Hsieh, J H ^a   Yeh, T H ^a   Li, C ^b   Chiu, C H ^c   Huang, C T ^c  

^a MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^c CHANG GUNG MEMORIAL HOSPITAL   (Taiwan)

Author keywords

Antibacterial properties; Co sputtering; Nanocomposite thin films; TaN (Ag Cu)

Indexed keywords

ANNEALING; BACTERIA; COBALT; COPPER; ESCHERICHIA COLI; FILM GROWTH; NANOCOMPOSITE FILMS; NANOCOMPOSITES; RAPID THERMAL ANNEALING; REACTIVE SPUTTERING; SPUTTER DEPOSITION; THIN FILMS;

ANNEALING TEMPERATURES; ANTI-BACTERIAL BEHAVIORS; ANTIBACTERIAL PROPERTIES; COSPUTTERING; NANOCOMPOSITE THIN FILMS; REACTIVE CO-SPUTTERING; TAN-(AG CU); TRIBOLOGICAL BEHAVIORS;

SILVER;

EID: 84877583072     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2012.02.016     Document Type: Article

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