Effect of plasma activated sintering (PAS) parameters on densification of copper powder

Materials Research Bulletin

Volumn 35, Issue 4, 2000, Pages 619-628

  Wang, S W ^a   Chen, L D ^a   Kang, Y S ^b   Niino, M ^b   Hirai, T ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b KAKUDA RESEARCH CENTER   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DENSIFICATION; ELECTRIC CURRENTS; ELECTRIC PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; PLASMA APPLICATIONS; POWDER METALS; PRESSURE EFFECTS; SINTERING; THERMAL EFFECTS;

PLASMA ACTIVATED SINTERING (PAS);

COPPER;

EID: 0034156091     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0025-5408(00)00246-4     Document Type: Article

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