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Volumn 193, Issue 1-3 SPEC. ISS., 2005, Pages 173-177

Effects of annealing on the microstructure and electrical properties of TaN-Cu nanocomposite thin films

Author keywords

Nanocomposite; TaN Cu; Temperature coefficient of resistivity; Thin film resistor

Indexed keywords

ANNEALING; COPPER; MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; TANTALUM ALLOYS;

AMORPHOUS MATRIX; MAGNETRON DC REACTIVE CO-SPUTTERING; RAPID THERMAL PROCESSING; THIN FILM RESISTORS (TFR);

THIN FILMS;

NANOCOMPOSITE;

EID: 13844281047 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/j.surfcoat.2004.08.128 Document Type: Article

Times cited : (19)

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