Superhard V-Si-N coatings (>50GPa) with the cell-like nanostructure prepared by magnetron sputtering

Surface and Coatings Technology

Volumn 232, Issue , 2013, Pages 600-605

  Huang, Feng ^a   Ge, Fangfang ^a   Zhu, Ping ^a,b   Wang, Huaiyong ^a,b   Meng, Fanping ^a   Li, Shengzhi ^b  

^a NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING   (China)

^b ANHUI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Cell like nanostructure; HRTEM; RF DC coupled Si source; Sputtering; V Si N coatings

Indexed keywords

ELASTIC RECOVERY; GROWTH STRUCTURES; HIGH PARTIAL PRESSURE; HRTEM; NANO-INDENTATION HARDNESS; PROCESS CONDITION; REACTIVE MAGNETRON CO-SPUTTERING; SI SOURCES;

CELLS; COATINGS; CYTOLOGY; HARDNESS; ION BOMBARDMENT; MAGNETRONS; NANOSTRUCTURES; SILICON NITRIDE; SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY;

SILICON;

EID: 84883461215     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2013.06.035     Document Type: Article

References (45)

1. Holleck H. J. Vac. Sci. Technol. A 1986, 4:2661.
2. Hauert R., Patscheider J. Adv. Eng. Mater. 2000, 2:247.
3. Mayrhofer P.H., Mitterer C., Hultman L., Clemens H. Prog. Mater. Sci. 2006, 51:1032.
4. Kramer B.M. Thin Solid Films 1983, 108:117.
5. Musil J. Surf. Coat. Technol. 2000, 125:322.
6. Veprek S., Veprek-Heijman M.G.J., Karvankova P., Prochazka J. Thin Solid Films 2005, 476:1.
7. Pogrebnjak A.D., Shpak A.P., Azarenkov N.A., Beresnev V.M. Physics-Uspekhi 2009, 52:29.
8. Musil J. Surf. Coat. Technol. 2012, 207:50.
9. Li S., Shi Y., Peng H. Plasma Chem. Plasma Process. 1992, 12:287.
10. Veprek S., Reiprich S., Li S. Appl. Phys. Lett. 1995, 66:2640.
11. Veprek S., Haussmann M., Reiprich S. J. Vac. Sci. Technol. A 1996, 14:46.
12. Veprek S., Haussmann M., Reiprich S. Mater. Res. Soc. Symp. Proc. 1996, 400:261.
13. Patscheider J., Zehnder T., Diserens D. Surf. Coat. Technol. 2001, 146-147:201.
14. Vaz F., Rebouta L., Cavaleiro A., da Silva M.F., Soares J.C. Surf. Coat. Technol. 1998, 100-101:110.
15. Diserens M., Patscheider J., Lévy F. Surf. Coat. Technol. 1998, 108-109:241.
16. Vaz F., Rebouta L., Goudeau P., Pacaud J., Garem H., Rivière J.P., Cavaleiro A., Alves E. Surf. Coat. Technol. 2000, 133-134:307.
17. Zhang X.D., Meng W.J., Wang W., Rehn L.E., Baldo P.M., Evans R.D. Surf. Coat. Technol. 2004, 177-178:325.
18. Procházka J., Karvánková P., Veprek-Heijman M.G.J., Veprek S. Mater. Sci. Eng., A 2004, 384:102.
19. Kauffmann F., Dehm G., Schier V., Schattke A., Beck T., Lang S., Arzt E. Thin Solid Films 2005, 473:114.
20. Li Z.G., Mori M., Miyake S., Kumagai M., Saito H., Muramatsu Y. Surf. Coat. Technol. 2005, 193:345.
21. Li Z., Miyake S., Wu Y. Jpn. J. Appl. Phys. 2006, 45:7866.
22. Zhang C.H., Lu X.C., Wang H., Luo J.B., Shen Y.G., Li K.Y. Appl. Surf. Sci. 2006, 252:6141.
23. Fu T., Zhou Z.F., Li K.Y., Shen Y.G. Surf. Coat. Technol. 2005, 200:2525.
24. Fu T., Shen Y.G., Zhou Z.F., Li K.Y. J. Vac. Sci. Technol. A 2006, 24:2094.
25. Benkahoul M., Sandu C.S., Tabet N., Parlinska-Wojtan M., Karimi A., Lévy F. Surf. Coat. Technol. 2004, 188-189:435.
26. Pilloud D., Pierson J.F., Marques A.P., Cavaleiro A. Surf. Coat. Technol. 2004, 180-181:352.
27. Sandu C.S., Cusnir N., Oezer D., Sanjines R., Patscheider J. Surf. Coat. Technol. 2009, 204:969.
28. Franz R., Neidhardt J., Sartory B., Kaindl R., Tessadri R., Polcik P., Derflinger V.H., Mitterer C. Tribol. Lett. 2006, 23:101.
29. Fateh N., Fontalvo G.A., Gassner G., Mitterer C. Wear 2007, 262:1152.
30. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564.
31. Kawai Y., Konishi N., Watanabe J., Ohmi T. Appl. Phys. Lett. 1994, 64:2223.
32. Hultman L., Sundgren J.-E., Greene J.E., Bergstrom D.B., Petrov I. J. Appl. Phys. 1995, 78:5395.
33. Gall D., Kodambaka S., Wall M.A., Petrov I., Greene J.E. J. Appl. Phys. 2003, 93:9086.
34. Barna P.B., Adamik M. Thin Solid Films 1998, 317:27.
35. Petrov I., Barna P.B., Hultman L., Greene J.E. J. Vac. Sci. Technol. A 2003, 21:S117.
36. Kong M., Zhao W., Wei L., Li G. J. Phys. D: Appl. Phys. 2007, 40:2858.
37. Hu, et al. J. Vac. Sci. Technol. A 2002, 20:1921. The authors referred the deposition temperature to a previous paper by the same group.
38. Bertóti I. Surf. Coat. Technol. 2002, 151-152:194.
39. Saha R., Nix W.D. Acta Mater. 2002, 50:23.
40. Park J.-K., Baik Y.-J. Mater. Lett. 2008, 62:2528.
41. Kolozsvári S., Pesch P., Ziebert C., Stueber M., Ulrich S. Plasma Process. Polym. 2009, 6:S146.
42. Meng F., Wang B., Ge F., Huang F. Surf. Coat. Technol. 2012, 213:77.
43. Pharr G.M., Callahan D.L., McAdams S.D., Tsui T.Y., Anders S., Anders A., Ager J.W., Brown I.G., Bhatia C.S., Silva S.R.P., Robertson J. Appl. Phys. Lett. 1996, 68:779.
44. Kelly A., MacMillan N.H. Strong solids 1986, 44-47. Clarendon Press, Oxford. 3rd ed.
45. Thornton J.A. J. Vac. Sci. Technol. A 1986, 4:3059.