Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic

Journal of Materials Science

Volumn 48, Issue 20, 2013, Pages 7224-7237

  Wang, Ming Qiu ^a   Yan, Jun ^a   Du, Shi Guo ^a   Zeng, Jian Wei ^a   Chang, Wen Ping ^a   Guo, Yi ^a   Li, Hong Guang ^a  

^a MECHANICAL ENGINEERING COLLEGE   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION CHARACTERISTIC; ATTENUATED TOTAL REFLECTION FOURIER TRANSFORM INFRARED; BATCH ADSORPTION EXPERIMENTS; CROSS LINKING AGENTS; ELECTROLESS NICKEL PLATING; ENERGY DISPERSIVE X RAY SPECTROSCOPY; SEMI-INTERPENETRATING POLYMER NETWORK (SEMI-IPN); SEMI-IPN HYDROGELS;

ADSORPTION; CHLORINE COMPOUNDS; COPPER; ELECTROLESS PLATING; HYDROGELS; METAL IONS; NICKEL; NICKEL PLATING; PHOTOELECTRONS; SCANNING ELECTRON MICROSCOPY; SURFACE RESISTANCE; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY; X RAY SPECTROSCOPY;

POLYVINYL CHLORIDES;

EID: 84881152165     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-013-7539-7     Document Type: Article

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