Electroless copper deposition on aluminum-seeded ABS plastics

Journal of Materials Science

Volumn 43, Issue 22, 2008, Pages 7121-7131

  Li, Dapeng ^a   Goodwin, Kate ^a   Yang, Chen Lu ^a  

^a UNIVERSITY OF MASSACHUSETTS DARTMOUTH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; BUTADIENE; CARBON BLACK; CHEMICAL VAPOR DEPOSITION; CONDUCTING POLYMERS; CONDUCTIVE PLASTICS; COPPER; COPPER PLATING; DEPOSITION; ELASTOMERS; ELECTROLESS PLATING; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; LIGHT METALS; METAL IONS; PLASTIC PRODUCTS; PLASTICITY; PLASTICS APPLICATIONS; POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RADIATION PROTECTION; RADIATION SHIELDING; STYRENE;

ABS PLASTICS; CONDUCTIVE LAYERS; COPPER DEPOSITIONS; COPPER IONS; COPPER LAYERS; DEPOSITION TIMES; ELECTROLESS; ELECTROLESS COPPER DEPOSITIONS; ELECTROMAGNETIC INTERFERENCE SHIELDING; OTHER APPLICATIONS; SUBSTRATE SURFACES;

ABS RESINS;

EID: 56449090304     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-008-3031-1     Document Type: Article

References (14)

1. Kuzmik JJ (1990) In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals and applications (Reprint Edition). The American Electroplaters and Surface Finishers Society, pp 377-399
2. DC Weng U Landau 1995 Direct electroplating on nonconductors J Electrochem Soci 142 8 2598
3. B Viswanathan 1993 Metallization of plastics by electroless plating Curr Sci 65 7 537
4. CA Deckert 1995 Electroless copper plating - a review. 1 Plat Surf Finish 82 2 48
5. CA Deckert 1995 Electroless copper plating - a review. 2 Plat Surf Finish 82 3 58
6. M Charbonnier M Romand 2006 Copper metallization of polymers by a palladium-free electroless process Surf Coat Technol 200 18-19 5478
7. Hudd AB, Bentley P, Fox J, Robinson M (2006) Method of forming a conductive metal region on a substrate. US Patent 20060134318 (pending)
8. Radovsky DA, Ronkese B J et al (1963) Method of electroplating on a dielectric base. US Patent 3,099,608
9. JJ Bladon A Lamola 1996 A palladium sulfide catalyst for electrolytic plating J Electrochem Soc 143 4 1206
10. CH Yang YY Wang 1999 A kinetic study of direct copper plating via Pd catalyst and S ligand J Electrochem Soc 146 12 4473
11. S Ono K Naitoh 1999 Initial propagation stage of direct copper plating on non-conducting substrates Electrochimica Acta 44 21-22 3697
12. GX Wang N Li 2006 Process of direct copper plating on ABS plastics Appl Surf Sci 253 2 480
13. DC Weng U Landau 1995 Direct electroplating on nonconductors J Electrochem Soc 142 8 2598
14. Mansukhani IR (1980) Plating of substrates by jet printing. US Patent 4,242,369