Electroless plating of copper on polytetrafluoroethylene films modified by surface-initiated free radical polymerization of 4-vinylpyridine

Surface Review and Letters

Volumn 14, Issue 2, 2007, Pages 241-253

  Chen, Yiwang ^a   Sun, Wei ^a   Deng, Qilan ^a   Chen, Lie ^a   He, Xiaohui ^a  

^a NANCHANG UNIVERSITY   (China)

Author keywords

4 vinylpyridine; Adhesion; Electroless plating; Polyterafluoroethylene

Indexed keywords

ADHESION; COPPER COMPOUNDS; ELECTROLESS PLATING; FREE RADICAL POLYMERIZATION; POLYTETRAFLUOROETHYLENES; SURFACE TREATMENT;

4-VINYLPYRIDINE; POLYTETRAFLUOROETHYLENE (PTFE) FILMS; SODIUM NAPHTHALENIDE; SURFACE ELEMENTAL COMPOSITION;

THIN FILMS;

EID: 34547273489     PISSN: 0218625X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0218625X07009323     Document Type: Article

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