Direct writing patterns for electroless plated copper thin film on plastic substrates

ACS Applied Materials and Interfaces

Volumn 4, Issue 10, 2012, Pages 5109-5113

  Liao, Ying Chih ^a   Kao, Zhen Kai ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

copper thin film patterns; electroless plating; inkjet printing; pen writing; plastic substrates; silver ion ink

Indexed keywords

ACTIVATING AGENTS; CONDUCTIVE COPPER; COPPER FILMS; COPPER THIN FILM; DIRECT WRITING; ELECTRICAL CONDUCTIVITY; ELECTROLESS; ELECTROLESS COPPER PLATING; FLEXIBLE PLASTIC SUBSTRATES; MICROPATTERNS; PLASTIC SUBSTRATES; POLYMER SURFACES; PRINTED PATTERNS; SILVER IONS; SILVER NITRATES;

COPPER PLATING; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; METAL IONS; PLASTIC SHEETS; SUBSTRATES; THIN FILMS;

COPPER;

EID: 84867766732     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am301654j     Document Type: Article

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