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Volumn 279, Issue 8, 2001, Pages 745-753

Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

(5) Yang, G H a Kang, E T a Neoh, K G a Zhang, Y a Tan, K L a

a NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

Copper; Electroless plating; Graft copolymerization; Polyimide; Surface

Indexed keywords

4 VINYLPYRIDINE; COPPER; IMIDAZOLE DERIVATIVE; MONOMER; NITROGEN; POLYIMIDE; PYRIDINE DERIVATIVE; VINYL DERIVATIVE;

ADHESION; ARTICLE; CHEMICAL MODIFICATION; CHEMICAL STRUCTURE; CONTROLLED STUDY; FILM; POLYMERIZATION; PRIORITY JOURNAL; ROENTGEN SPECTROSCOPY; STRENGTH; SURFACE PROPERTY; ULTRAVIOLET RADIATION;

EID: 0034872757 PISSN: 0303402X EISSN: None Source Type: Journal
DOI: 10.1007/s003960100485 Document Type: Article

Times cited : (49)

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