Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks

International Journal of Heat and Mass Transfer

Volumn 65, Issue , 2013, Pages 33-43

  Renfer, Adrian ^a,b   Tiwari, Manish K ^a   Tiwari, Rashmita ^a   Alfieri, Fabio ^a   Brunschwiler, Thomas ^b   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

3D integrated cooling; Electronics; Micro LIF; Microscale flows; Microscale heat transfer; Vortex shedding

Indexed keywords

HEAT TRANSFER ENHANCEMENT; INTEGRATED COOLING; LASER INDUCED FLUORESCENCE; LOCAL NUSSELT NUMBER; MICRO-LIF; MICROSCALE FLOWS; MICROSCALE HEAT TRANSFER; TEMPERATURE UNIFORMITY;

COOLING SYSTEMS; ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; ENERGY EFFICIENCY; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; LIQUIDS; NUSSELT NUMBER; REYNOLDS NUMBER; THREE DIMENSIONAL COMPUTER GRAPHICS; VORTEX SHEDDING;

ELECTRONIC COOLING;

EID: 84879448868     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2013.05.066     Document Type: Article

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