Optimal thermal operation of liquid-cooled electronic chips

International Journal of Heat and Mass Transfer

Volumn 55, Issue 7-8, 2012, Pages 1957-1969

  Sharma, Chander Shekhar ^a   Zimmermann, Severin ^a   Tiwari, Manish K ^a   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

CFD; Electronic reliability; Electronics cooling; Exergy; Manifold microchannel heat sink; Pareto optimality

Indexed keywords

CHIP RELIABILITY; COOLANT FLOW RATES; COOLANT INLET TEMPERATURE; DESIGN ANALYSIS; ELECTRONIC CHIPS; ELECTRONICS COOLING; MANIFOLD MICROCHANNEL; MULTI OBJECTIVE; MULTI-CRITERIA; OPTIMAL OPERATING CONDITIONS; PARETO-OPTIMALITY; SINGLE OBJECTIVE OPTIMIZATION; SINGLE PARAMETER; THERMAL OPERATIONS; THERMAL RELIABILITY;

COMPUTATIONAL FLUID DYNAMICS; COOLANTS; ELECTRONIC COOLING; EXERGY; HEAT SINKS; INLET FLOW; MICROCHANNELS; MULTIOBJECTIVE OPTIMIZATION; RELIABILITY; WASTE HEAT;

MICROPROCESSOR CHIPS;

EID: 84856349848     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2011.11.052     Document Type: Article

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