On the significance of developing boundary layers in integrated water cooled 3D chip stacks

International Journal of Heat and Mass Transfer

Volumn 55, Issue 19-20, 2012, Pages 5222-5232

  Alfieri, Fabio ^a   Tiwari, Manish K ^a   Zinovik, Igor ^a   Brunschwiler, Thomas ^b   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

3D integrated water cooling; CFD; Chip stack; Developing flow; Micro cooling structure; Porous medium

Indexed keywords

CHIP STACK; DEVELOPING FLOW; MICRO COOLING; POROUS MEDIUM; WATER COOLING;

BOUNDARY LAYERS; COMPUTATIONAL FLUID DYNAMICS; FINS (HEAT EXCHANGE); HEAT TRANSFER; INTEGRATION; MICROCAVITIES; MICROCHANNELS; POROUS MATERIALS; REYNOLDS NUMBER; VEHICULAR TUNNELS;

THREE DIMENSIONAL;

EID: 84863507987     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2012.05.029     Document Type: Article

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