메뉴 건너뛰기




Volumn 70, Issue , 2013, Pages 114-126

Effects of melting temperature and the presence of internal fins on the performance of a phase change material (PCM)-based heat sink

Author keywords

Heat sinks; Internal fins; Melting temperature; Phase change materials; Thermal energy storage; Thermal management of electronics

Indexed keywords

INTERNAL FINS; MAXIMUM TEMPERATURE RISE; PHASE CHANGE MATERIAL (PCM); PULSED HEAT LOADS; THERMAL CONDITION;

EID: 84877613091     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2013.03.015     Document Type: Article
Times cited : (91)

References (39)
  • 1
    • 33750629504 scopus 로고    scopus 로고
    • Advances in mesoscale thermal management technologies for microelectronics
    • S.V. Garimella Advances in mesoscale thermal management technologies for microelectronics Microelectronics Journal 37 2006 1165 1185
    • (2006) Microelectronics Journal , vol.37 , pp. 1165-1185
    • Garimella, S.V.1
  • 3
    • 0030194659 scopus 로고    scopus 로고
    • Application of phase change materials for passive thermal control of plastic quad flat packages: A computational study
    • D. Pal, and Y. Joshi Application of phase change materials for passive thermal control of plastic quad flat packages: a computational study Numerical Heat Transfer, Part A Applications 30 1996 19 34
    • (1996) Numerical Heat Transfer, Part A Applications , vol.30 , pp. 19-34
    • Pal, D.1    Joshi, Y.2
  • 5
    • 0006599249 scopus 로고    scopus 로고
    • Transient thermal design of wearable computers with embedded electronics using phase change materials
    • N. Leoni, and C.H. Amon Transient thermal design of wearable computers with embedded electronics using phase change materials HTD-Vol. 343, National Heat Transfer Conference ASME 5 1997 49 56
    • (1997) HTD-Vol. 343, National Heat Transfer Conference ASME , vol.5 , pp. 49-56
    • Leoni, N.1    Amon, C.H.2
  • 6
    • 0032047946 scopus 로고    scopus 로고
    • Thermal management of an avionics module using solid-liquid phase-change materials
    • D. Pal, and Y.K. Joshi Thermal management of an avionics module using solid-liquid phase-change materials Journal of Thermophysics and Heat Transfer 12 1998 256 262
    • (1998) Journal of Thermophysics and Heat Transfer , vol.12 , pp. 256-262
    • Pal, D.1    Joshi, Y.K.2
  • 7
    • 0033356399 scopus 로고    scopus 로고
    • Transient thermal management of temperature fluctuations during time varying workloads on portable electronics
    • M.J. Vesligaj, and C.H. Amon Transient thermal management of temperature fluctuations during time varying workloads on portable electronics IEEE Transactions on Components and Packaging Technology 22 1999 541 550
    • (1999) IEEE Transactions on Components and Packaging Technology , vol.22 , pp. 541-550
    • Vesligaj, M.J.1    Amon, C.H.2
  • 8
    • 0343237735 scopus 로고    scopus 로고
    • Thermal management of high power electronics with phase change cooling
    • T.J. Lu Thermal management of high power electronics with phase change cooling International Journal of Heat and Mass Transfer 43 2000 2245 2256
    • (2000) International Journal of Heat and Mass Transfer , vol.43 , pp. 2245-2256
    • Lu, T.J.1
  • 9
    • 0040154759 scopus 로고    scopus 로고
    • Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses
    • A.G. Evans, M.Y. He, J.W. Hutchinson, and M. Shaw Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses Journal of Electronic Packaging, Transactions of the ASME 123 2001 211 217
    • (2001) Journal of Electronic Packaging, Transactions of the ASME , vol.123 , pp. 211-217
    • Evans, A.G.1    He, M.Y.2    Hutchinson, J.W.3    Shaw, M.4
  • 11
    • 0038142372 scopus 로고    scopus 로고
    • PCM thermal control unit for portable electronic devices: Experimental and numerical studies
    • E.M. Alawadhi, and C.H. Amon PCM thermal control unit for portable electronic devices: experimental and numerical studies IEEE Transactions on Components and Packaging Technology 26 2003 116 125
    • (2003) IEEE Transactions on Components and Packaging Technology , vol.26 , pp. 116-125
    • Alawadhi, E.M.1    Amon, C.H.2
  • 13
    • 13444266143 scopus 로고    scopus 로고
    • Energy efficient thermal management of electronic components using solid-liquid phase change materials
    • D.-W. Yoo, and Y.K. Joshi Energy efficient thermal management of electronic components using solid-liquid phase change materials IEEE Transactions on Device and Materials Reliability 4 2004 641 649
    • (2004) IEEE Transactions on Device and Materials Reliability , vol.4 , pp. 641-649
    • Yoo, D.-W.1    Joshi, Y.K.2
  • 14
    • 0242573522 scopus 로고    scopus 로고
    • Cooling of mobile electronic devices using phase change materials
    • F.L. Tan, and C.P. Tso Cooling of mobile electronic devices using phase change materials Applied Thermal Engineering 24 2004 159 169
    • (2004) Applied Thermal Engineering , vol.24 , pp. 159-169
    • Tan, F.L.1    Tso, C.P.2
  • 18
    • 34447501562 scopus 로고    scopus 로고
    • Application of phase change materials in thermal management of electronics
    • R. Kandasamy, X.-Q. Wang, and A.S. Mujumdar Application of phase change materials in thermal management of electronics Applied Thermal Engineering 27 2007 2822 2832
    • (2007) Applied Thermal Engineering , vol.27 , pp. 2822-2832
    • Kandasamy, R.1    Wang, X.-Q.2    Mujumdar, A.S.3
  • 19
    • 34447542580 scopus 로고    scopus 로고
    • Effect of orientation for phase change material (PCM)-based heat sinks for transient thermal management of electronic components
    • X.-Q. Wang, A.S. Mujumdar, and C. Yap Effect of orientation for phase change material (PCM)-based heat sinks for transient thermal management of electronic components International Communications in Heat and Mass Transfer 34 2007 801 808
    • (2007) International Communications in Heat and Mass Transfer , vol.34 , pp. 801-808
    • Wang, X.-Q.1    Mujumdar, A.S.2    Yap, C.3
  • 20
    • 39749179128 scopus 로고    scopus 로고
    • Transient cooling of electronics using phase change material (PCM)-based heat sinks
    • R. Kandasamy, X.-Q. Wang, and A.S. Mujumdar Transient cooling of electronics using phase change material (PCM)-based heat sinks Applied Thermal Engineering 28 2008 1047 1057
    • (2008) Applied Thermal Engineering , vol.28 , pp. 1047-1057
    • Kandasamy, R.1    Wang, X.-Q.2    Mujumdar, A.S.3
  • 21
    • 39149093665 scopus 로고    scopus 로고
    • Numerical investigation of a PCM-based heat sink with internal fins: Constant heat flux
    • V. Shatikian, G. Ziskind, and R. Letan Numerical investigation of a PCM-based heat sink with internal fins: constant heat flux International Journal of Heat and Mass Transfer 51 2008 1488 1493
    • (2008) International Journal of Heat and Mass Transfer , vol.51 , pp. 1488-1493
    • Shatikian, V.1    Ziskind, G.2    Letan, R.3
  • 22
    • 42649135186 scopus 로고    scopus 로고
    • Studies on optimum distribution of fins in heat sinks filled with phase change materials
    • 4 pages
    • S.K. Saha, K. Srinivasan, and P. Dutta Studies on optimum distribution of fins in heat sinks filled with phase change materials Journal of Heat Transfer, Transactions of the ASME 130 2008 034505 4 pages
    • (2008) Journal of Heat Transfer, Transactions of the ASME , vol.130 , pp. 034505
    • Saha, S.K.1    Srinivasan, K.2    Dutta, P.3
  • 23
    • 77955213298 scopus 로고    scopus 로고
    • Passive cooling of protruding electronic components by latent heat of fusion storage
    • 10 pages
    • M. Faraji, and H. El Qarnia Passive cooling of protruding electronic components by latent heat of fusion storage Journal of Electronic Packaging, Transactions of the ASME 131 2009 021011 10 pages
    • (2009) Journal of Electronic Packaging, Transactions of the ASME , vol.131 , pp. 021011
    • Faraji, M.1    El Qarnia, H.2
  • 24
    • 71849083002 scopus 로고    scopus 로고
    • Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks
    • S.C. Fok, W. Shen, and F.L. Tan Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks International Journal of Thermal Sciences 49 2010 109 117
    • (2010) International Journal of Thermal Sciences , vol.49 , pp. 109-117
    • Fok, S.C.1    Shen, W.2    Tan, F.L.3
  • 26
    • 77955656078 scopus 로고    scopus 로고
    • Thermal management of electronic components with thermal adaptation composite material
    • H. Yin, X. Gao, J. Ding, Z. Zhang, and Y. Fang Thermal management of electronic components with thermal adaptation composite material Applied Energy 87 2010 3784 3791
    • (2010) Applied Energy , vol.87 , pp. 3784-3791
    • Yin, H.1    Gao, X.2    Ding, J.3    Zhang, Z.4    Fang, Y.5
  • 27
    • 84875012116 scopus 로고    scopus 로고
    • Experimental and thermal network study on the performance of a pins studded phase change materials in electronic device cooling
    • T. Hatakeyama, M. Ishizuka, S. Takakuwa, S. Nakagawa, and K. Takagi Experimental and thermal network study on the performance of a pins studded phase change materials in electronic device cooling Journal of Thermal Science and Technology 6 2011 164 177
    • (2011) Journal of Thermal Science and Technology , vol.6 , pp. 164-177
    • Hatakeyama, T.1    Ishizuka, M.2    Takakuwa, S.3    Nakagawa, S.4    Takagi, K.5
  • 28
    • 79957481978 scopus 로고    scopus 로고
    • Effect of melt convection on the optimum thermal design of heat sinks with phase change material
    • S.K. Saha, and P. Dutta Effect of melt convection on the optimum thermal design of heat sinks with phase change material Journal of Enhanced Heat Transfer 18 2011 249 259
    • (2011) Journal of Enhanced Heat Transfer , vol.18 , pp. 249-259
    • Saha, S.K.1    Dutta, P.2
  • 30
    • 80052919438 scopus 로고    scopus 로고
    • Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins
    • S.F. Hosseinizadeh, F.L. Tan, and S.M. Moosania Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins Applied Thermal Engineering 31 2011 3827 3838
    • (2011) Applied Thermal Engineering , vol.31 , pp. 3827-3838
    • Hosseinizadeh, S.F.1    Tan, F.L.2    Moosania, S.M.3
  • 31
    • 79961021456 scopus 로고    scopus 로고
    • Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink
    • Y.-H. Wang, and Y.-T. Yang Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink Energy 36 2011 5214 5224
    • (2011) Energy , vol.36 , pp. 5214-5224
    • Wang, Y.-H.1    Yang, Y.-T.2
  • 32
    • 80054680194 scopus 로고    scopus 로고
    • Numerical simulation of three-dimensional transient cooling application on a portable electronic device using phase change material
    • Y.-T. Yang, and Y.-H. Wang Numerical simulation of three-dimensional transient cooling application on a portable electronic device using phase change material International Journal of Thermal Sciences 51 2012 155 162
    • (2012) International Journal of Thermal Sciences , vol.51 , pp. 155-162
    • Yang, Y.-T.1    Wang, Y.-H.2
  • 33
    • 81855198847 scopus 로고    scopus 로고
    • Thermal performance of heat spreader for electronics cooling with incorporated phase change material
    • M. Jaworski Thermal performance of heat spreader for electronics cooling with incorporated phase change material Applied Thermal Engineering 35 2012 212 219
    • (2012) Applied Thermal Engineering , vol.35 , pp. 212-219
    • Jaworski, M.1
  • 35
    • 84857311893 scopus 로고    scopus 로고
    • Numerical investigation of phase change material-based heat storage unit on cooling of mobile phone
    • F.L. Tan, and S.C. Fok Numerical investigation of phase change material-based heat storage unit on cooling of mobile phone Heat Transfer Engineering 33 2012 494 504
    • (2012) Heat Transfer Engineering , vol.33 , pp. 494-504
    • Tan, F.L.1    Fok, S.C.2
  • 36
    • 84355161407 scopus 로고    scopus 로고
    • Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling
    • R. Baby, and C. Balaji Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling International Journal of Heat and Mass Transfer 55 2012 1642 1649
    • (2012) International Journal of Heat and Mass Transfer , vol.55 , pp. 1642-1649
    • Baby, R.1    Balaji, C.2
  • 37
    • 78149413789 scopus 로고    scopus 로고
    • Thermal conductivity enhancement of phase change materials for thermal energy storage: A review
    • L. Fan, and J.M. Khodadadi Thermal conductivity enhancement of phase change materials for thermal energy storage: a review Renewable and Sustainable Energy Reviews 15 2011 24 46
    • (2011) Renewable and Sustainable Energy Reviews , vol.15 , pp. 24-46
    • Fan, L.1    Khodadadi, J.M.2
  • 39
    • 0025488604 scopus 로고
    • Application of a spherical thermal conductivity cell to solid n-eicosane paraffin
    • P.C. Stryker, and E.M. Sparrow Application of a spherical thermal conductivity cell to solid n-eicosane paraffin International Journal of Heat and Mass Transfer 33 1990 1781 1793
    • (1990) International Journal of Heat and Mass Transfer , vol.33 , pp. 1781-1793
    • Stryker, P.C.1    Sparrow, E.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.