Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks

International Journal of Thermal Sciences

Volumn 49, Issue 1, 2010, Pages 109-117

  Fok, S C ^a   Shen, W ^b   Tan, F L ^b  

^a KHALIFA UNIVERSITY   (United Arab Emirates)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electronics cooling; Heat storage device; Phase change materials

Indexed keywords

ELECTRONIC DEVICE; ELECTRONICS COOLING; EXPERIMENTAL STUDIES; HEAT SOURCES; HEAT STORAGE DEVICE; HEAT STORAGE DEVICES; INTERNAL FINS; N-EICOSANE; POWER LEVELS; THERMAL PERFORMANCE;

BUOYANCY; COOLING; ELECTRON DEVICES; FINS (HEAT EXCHANGE); FORCED CONVECTION; HEAT STORAGE; MOBILE DEVICES; PARAFFINS; PULSE CODE MODULATION; THERMOELECTRIC EQUIPMENT;

PHASE CHANGE MATERIALS;

EID: 71849083002     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2009.06.011     Document Type: Article

References (21)

1. Gelsinger P. Feeling the heat. Economist 366 (2003) 29-30
2. Lu T.J. Thermal management of high power electronics with phase change cooling. International Journal of Heat and Mass Transfer 43 (2000) 2245-2256
3. Hodes M., Weinstein R.D., Piccini J.M., Manzione L., and Chen C. Transient thermal management of a handset using phase change material. Journal of Electronic Packaging (2002) 419-426
4. Alawadhi E.M., and Amon C.H. PCM thermal control unit for portable electronic devices: experimental and numerical studies. IEEE Transaction on Component and Packaging Technologies 26 (2003) 116-125
5. Tan F.L., and Tso C.P. Cooling of mobile electronic devices using phase change materials. Applied Thermal Engineering 24 (2004) 159-169
6. Tan F.L., and Fok S.C. Cooling of helmet using phase change materials. Applied Thermal Engineering 26 (2006) 2062-2072
7. Kandasamy R., Wang X.Q., and Mujumdar A.S. Application of phase change materials in thermal management of electronics. Applied Thermal Engineering 27 (2007) 2822-2832
8. Kandasamy R., Wang X.Q., and Mujumdar A.S. Transient cooling of electronics using phase change material (PCM)-based heat sinks. Applied Thermal Engineering 28 (2008) 1047-1057
9. Wang X.Q., Mujumdar A.S., and Yap C. Effect of orientation for phase change material (PCM)-based heat sinks for transient thermal management of electric components. International Communications in Heat and Mass Transfer 34 (2007) 801-808
10. Sabbah R., Kizilel R., Selman J.R., and Al-Hallaj S. Active (air-cooled) vs. passive (phase change material) thermal management of high power lithium-ion packs: limitation of temperature rise and uniformity of temperature distribution. Journal of Power Sources 182 (2008) 630-638
11. Moxey G. Communications power owes to SMD leadless. Electronic Engineering 72 (2000) 99-102
12. Anderson J.B., and Pedersen G.F. The technology of mobile telephone systems relevant for risk assessment. Radiation Protection Dosimetry 72 (1997) 249-257
13. Luo Z., Cho H., Luo X., and Cho K. System thermal analysis for mobile phone. Applied Thermal Engineering 28 (2008) 1889-1895
14. Chow L.C., and Zhong J.K. Thermal conductivity enhancement for phase change storage media. International Journal of Heat and Mass Transfer 23 (1996) 91-100
15. Akhilesh R., Narasimhan A., and Balaji C. Method to improve geometry for heat transfer enhancement in PCM composite heat sinks. International Journal of Heat and Mass Transfer 48 (2005) 2759-2770
16. Shatikian V., Ziskind G., and Letan R. Numerical investigation of a PCM-based heat sink with internal fins: Constant heat flux. International Journal of Heat and Mass Transfer 51 (2008) 1448-1493
17. Yin H., Gao X., Ding J., and Zhang Z. Experimental research on heat transfer mechanism of heat sink with composite phase change materials. Energy Conversion and Management 49 (2008) 1740-1746
18. G.W. Burns, M.G. Scroger, G.F. Strouse, M.C. Croarkin and W.F. Guthrie, Temperature-electromotive force reference functions and tables for letter-designated thermocouple types based on the ITS-90, NIST Monograph 175, pp. 250, 1993.
19. B.N. Taylor, C.E. Kuyatt, Guidelines for evaluating and expressing the uncertainty of NIST measurement results, NIST Technical Note 1297, 1994.
20. Greenspan J.D., Roy E.A., Caldwell P.A., and Farooq N.S. Thermosensory intensity and effect throughout the perceptible range. Somatosensory & Motor Research 21 (2003) 19-26
21. Story G.M. The emerging role of TRP channels in mechanisms of temperature and pain sensation. Current Neuropharmacology 4 (2006) 183-196