Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink

Energy

Volumn 36, Issue 8, 2011, Pages 5214-5224

  Wang, Yi Hsien ^a   Yang, Yue Tzu ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electronic cooling; Numerical simulation; Phase change material

Indexed keywords

BUOYANCY; ELECTRONIC COOLING; FINS (HEAT EXCHANGE); FORCED CONVECTION; HYBRID MATERIALS; THREE DIMENSIONAL;

CALCULATING TIME; CHARGE AND DISCHARGE; EXPERIMENTAL DATA; HEATING POWER; HYBRID HEAT SINK; MELTING TIME; NUMERICAL COMPUTATIONS; NUMERICAL PREDICTIONS; OPERATION TEMPERATURE; PHASE CHANGE; PORTABLE ELECTRONIC DEVICES; SURFACE TEMPERATURES; THEORETICAL MODELS; TRANSIENT COOLING;

PHASE CHANGE MATERIALS;

COOLING; DATA SET; ELECTRONIC EQUIPMENT; HEATING; MELTING; NUMERICAL MODEL; PREDICTION; SURFACE TEMPERATURE; THREE-DIMENSIONAL MODELING;

EID: 79961021456     PISSN: 03605442     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.energy.2011.06.023     Document Type: Article

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