Thermal performance of heat spreader for electronics cooling with incorporated phase change material

Applied Thermal Engineering

Volumn 35, Issue 1, 2012, Pages 212-219

  Jaworski, MacIej ^a  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Electronics cooling; Heat spreaders; Phase change materials (PCM); Thermal management

Indexed keywords

COOLING ELEMENTS; ELECTRONIC DEVICE; ELECTRONICS COOLING; HEAT SPREADERS; HEAT TRANSFER CONDITIONS; HEAT TRANSFER SURFACES; HIGH THERMAL; MELTING PROCESS; NEW DESIGN; OVERALL THERMAL RESISTANCE; PIN-FINS; RAPID VARIATION; STEADY CONDITIONS; STEADY STATE; TEMPERATURE VARIATION; THERMAL CHARACTERISTICS; THERMAL PERFORMANCE; THIN-WALL PIPE; TRANSIENT CONDITIONS; TRANSIENT HEAT TRANSFER;

COMPUTER SIMULATION; ELECTRONIC COOLING; HEAT TRANSFER; HEATING EQUIPMENT; SPREADERS; TEMPERATURE CONTROL;

PHASE CHANGE MATERIALS;

EID: 81855198847     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2011.10.036     Document Type: Article

References (36)

1. R.C. Chu Thermal Management Roadmap. Cooling Electronic Products from Hand-Held Devices to Supercomputers 2003 MIT Rohsenow Symposium Cambridge, MA
2. S. Shuler Thermal management, understanding how to incorporate effective thermal strategies into overall portable electronic design for better performance Materials and Design 21 2000 39 44
3. R.J. McGlen, R. Jachuck, and S. Lin Integrated thermal management techniques for high power electronic devices Applied Thermal Engineering 24 2004 1143 1156
4. A.J. Robinson, and E. Schnitzler An experimental investigation of free and submerged miniature liquid jet array impingement heat transfer Experimental Thermal and Fluid Science 32 2007 1 13 (Pubitemid 47440165)
5. M. Arik, and A. Bar-Cohen Pool boiling of perfluorocarbon mixtures on silicon surfaces International Journal of Heat and Mass Transfer 53 2010 5596 5604
6. H. Honda, and J.J. Wei Enhanced boiling heat transfer from electronic components by use of surface microstructures Experimental Thermal and Fluid Science 28 2004 159 169 (Pubitemid 38033977)
7. S. Lin, K. Sefiane, and J.R.E. Christy Prospects of confined flow boiling in thermal management of microsystems Applied Thermal Engineering 22 2002 825 837 (Pubitemid 34284540)
8. L. Lanchao, and P. Rengasamy Heat transfer characteristics of spray cooling in a closed loop International Journal of Heat and Mass Transfer 46 2003 3737 3746
9. Yu.F. Maydanik Loop heat pipes Applied Thermal Engineering 25 2005 635 675
10. V.G. Pastukhov, Yu.F. Maydanik, C.V. Vershinin, and M.A. Korukov Miniature loop heat pipes for electronics cooling Applied Thermal Engineering 23 2003 1125 1135
11. K. Kwang-Soo, W. Myong-Hee, K. Jong-Wook, and B. Byung-Joon Heat pipe cooling technology for desktop PC CPU Applied Thermal Engineering 23 2003 1137 1144
12. J. Darabi, and K. Ekula Development of a chip-integrated micro cooling device Microelectronics Journal 34 2003 1067 1074
13. F.L. Tan, and C.P. Tso Cooling of mobile electronic devices using phase change materials Applied Thermal Engineering 24 2004 159 169
14. G. Setoh, F.L. Tan, and S.C. Fok Experimental studies on the use of a phase change material for cooling mobile phones International Communications in Heat and Mass Transfer 37 9 2010 1403 1410
15. E. Alawadhi, and C. Amon PCM thermal control unit for portable electronic devices, experimental and numerical studies IEEE Transactions on Components Packaging Technology 26 2003 116 125
16. A.S. Sundaram, R.V. Seeniraj, and R. Velraj An experimental investigation on passive cooling system comprising phase change material and two-phase closed thermosyphon for telecom shelters in tropical and desert regions Energy and Buildings 42 2010 1726 1735
17. J. Wilson Phase change materials thermal properties Electronics Cooling 11 2 2005
18. R. Akhilesh, A. Narasimhan, and C. Balaji Method to improve geometry for heat transfer enhancement in PCM composite heat sinks International Journal of Heat and Mass Transfer 48 2005 2759 2770 (Pubitemid 40572824)
19. S.C. Fok, W. Shen, and F.L. Tan Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks International Journal of Thermal Sciences 49 2010 109 117
20. R. Kandasamy, X.-Q. Wang, and A.S. Mujumdar Application of phase change materials in thermal management of electronics Applied Thermal Engineering 27 2007 2822 2832 (Pubitemid 47296383)
21. V. Shatikian, G. Ziskind, and R. Letan Numerical investigation of a PCM-based heat sink with internal fins International Journal of Heat and Mass Transfer 48 2005 3689 3706
22. K.C. Nayak, S.K. Saha, K. Srinivasan, and P. Dutta A numerical model for heat sinks with phase change materials and thermal conductivity enhancers International Journal of Heat and Mass Transfer 49 2006 1833 1844
23. R. Kandasamy, X.-Q. Wang, and A.S. Mujumdar Transient cooling of electronics using phase change material (PCM)-based heat sinks Applied Thermal Engineering 28 2008 1047 1057 (Pubitemid 351312692)
24. S.K. Saha, and P. Dutta Heat transfer correlations for PCM-based heat sinks with plate fins Applied Thermal Engineering 30 2010 2485 2491
25. H. Yin, X. Gao, J. Ding, and Z. Zhang Experimental research on heat transfer mechanism of heat sink with composite phase change materials Energy Conversion and Management 49 2008 1740 1746
26. H. Yin, X. Gao, J. Ding, Z. Zhang, and Y. Fang Thermal management of electronic components with thermal adaptation composite material Applied Energy 87 12 2010 3784 3791
27. O. Mesalhy, K. Lafdi, and A. Elgafy Carbon foam matrices saturated with PCM for thermal protection purposes Carbon 44 2006 2080 2088 (Pubitemid 43782591)
28. K. Lafdi, M. Almajali, and O. Huzayyin Thermal properties of copper-coated carbon foams Carbon 47 2009 2620 2626
29. S. Shaikh, and K. Lafdi C/C composite, carbon nanotube and paraffin wax hybrid systems for the thermal control of pulsed power in electronics Carbon 48 2010 813 824
30. Y.-C. Weng, H.-P. Cho, C.-C. Chang, and S.-L. Chen Heat pipe with PCM for electronic cooling Applied Energy 88 2011 1825 1833
31. R. Domański, J. Kołtyś, M. Jaworski, Temperature Control of Electronics with the Use of Phase Change Materials (PCM) - Experimental Investigation. HEAT 2008, Proc. Fifth Int. Conf. on Transport Phenomena in Multiphase Systems (2008) vol. 2, 175-180, Bialystok, Poland.
32. M. Jaworski, Radiator for electronics cooling, Polish Patent Office P.372563 (2009).
33. A. Bejan, and A.D. Kraus Heat Transfer Handbook 2003 John Wiley & Sons Hoboken, New Jersey
34. M. Jaworski, Numerical Analysis of heat flow through the radiator for electronics cooling. Assessment of the influence of geometrical dimensions on its performance, Proc. Symposium of Heat and Mass Transfer (2007) vol. 1, 523-530, Koszalin, Poland.
35. www.micforg.co.jp, Alpha Company Ltd, Japan (August, 2011).
36. S. Ndao, Y. Peles, and M.K. Jensen Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies International Journal of Heat and Mass Transfer 52 2009 4317 4326