Application of phase change materials for passive thermal control of plastic quad flat packages: A computational study

Numerical Heat Transfer; Part A: Applications

Volumn 30, Issue 1, 1996, Pages 19-34

  Pal, D ^a   Joshi, Y ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; EQUATIONS OF STATE; FINITE VOLUME METHOD; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PLASTIC PRODUCTS; PRINTED CIRCUIT BOARDS; TEMPERATURE; THERMAL CONDUCTIVITY; THERMAL VARIABLES CONTROL; THREE DIMENSIONAL;

IMPLICIT FINITE VOLUME NUMERICAL TECHNIQUE; PASSIVE THERMAL CONTROL; PHASE CHANGE MATERIALS; PLASTIC QUAD FLAT PACKAGE; SINGLE DOMAIN ENTHALPY POROSITY TECHNIQUES;

PHASE TRANSITIONS;

EID: 0030194659     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10407789608913826     Document Type: Article

References (7)

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7. A. D. Brent, V. R. Voller, and K. J. Reid, Enthalpy-Porosity Technique for Modeling Convection-Diffusion Phase Change: Application to the Melting of a Pure Metal, Numer. Heat Transfer, vol. 13, pp. 297-318, 1988.