Transient thermal management of temperature fluctuations during time varying workloads on portable electronics

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 541-550

  Vesligaj, Mark J ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTRIC ENERGY STORAGE; ELECTRIC LOADS; EPOXY RESINS; MATHEMATICAL MODELS; PASSIVE NETWORKS; PHASE TRANSITIONS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMOANALYSIS;

PHASE CHANGE MATERIALS (PCM); PORTABLE ELECTRONICS; THERMAL CONTROL UNITS (TCU); TRANSIENT THERMAL MANAGEMENT;

INDUSTRIAL ELECTRONICS;

EID: 0033356399     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814970     Document Type: Article

References (20)

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