Passive cooling of protruding electronic components by latent heat of fusion storage

Journal of Electronic Packaging

Volumn 131, Issue 2, 2009, Pages 0210111-02101110

  Faraji, Mustapha ^a   Qarnia, Hamid El ^a  

^a CADI AYYAD UNIVERSITY   (Morocco)

Author keywords

Electronic cooling; Heat transfer; Melting; Phase change material; Protruding electronic component

Indexed keywords

HEAT CONDUCTION; HEAT FLUX; HEAT SINKS; INTERFACES (MATERIALS); ITERATIVE METHODS; MELTING; NETWORK COMPONENTS; PHASE CHANGE MATERIALS; SUBSTRATES; THERMAL MANAGEMENT (ELECTRONICS);

ELECTRONIC CHIPS; ELECTRONIC COMPONENT; ELECTRONICS COOLING; HYBRID HEAT SINK; LATENT HEAT OF FUSION; MELTING; PASSIVE COOLING; POWER; PROTRUDING ELECTRONIC COMPONENT; THERMAL PERFORMANCE;

ELECTRONIC COOLING;

EID: 77955213298     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3103953     Document Type: Article

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