Thermal management of electronic components with thermal adaptation composite material

Applied Energy

Volumn 87, Issue 12, 2010, Pages 3784-3791

  Yin, Huibin ^a   Gao, Xuenong ^b   Ding, Jing ^a   Zhang, Zhengguo ^b   Fang, Yutang ^b  

^a SUN YAT SEN UNIVERSITY   (China)

^b SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electronic component; Heat storage unit; Thermal adaptation composite material; Thermal management

Indexed keywords

COMPOSITE MATERIALS; COOLING; COOLING SYSTEMS; HEAT STORAGE; HEAT TRANSFER; NETWORK COMPONENTS; STORAGE (MATERIALS); TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION; THERMAL VARIABLES CONTROL; THERMOELECTRIC EQUIPMENT;

COOLING CAPACITY; ELECTRONIC COMPONENT; EXPANDED GRAPHITE; EXPERIMENTAL SYSTEM; HEAT STORAGE CAPACITY; HEAT STORAGE UNITS; TEMPERATURE VARIATION; THERMAL ADAPTATION;

ELECTRONIC COOLING;

COMPOSITE; COOLING; DESIGN; ELECTRONIC EQUIPMENT; EXPERIMENTAL STUDY; GRAPHITE; HEAT TRANSFER; PERFORMANCE ASSESSMENT; THERMAL CONDUCTIVITY; THERMAL EXPANSION; WAX;

EID: 77955656078     PISSN: 03062619     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apenergy.2010.06.007     Document Type: Article

References (13)

1. Yeh L.T. Review of heat transfer technologies in electronic equipment. J Electron Pack 1995, 117(4):333-339.
2. Yin H.B., Gao X.N., Ding J., Zhang Z.G. Experimental research on heat transfer mechanism of heat sink with composite phase change materials. Energy Convers Manage 2008, 49(6):1740-1746.
3. Zhou W., Zhang F., Wang X.Q. Prospect of thermal control phase change in electronic devices. Chin J Electron Dev 2007, 30(1). [in Chinese].
4. Pal D., Joshi Y.K. Application of phase change materials to thermal control of electronic modules: a computational study. J Electron Pack 1997, 119(1):40-50.
5. Abhat A, Groll M. Investigation of phase change material (PCM) devices for thermal control purposes in satellites. AIAA74-728; 1974.
6. Zhang F., Wang X.Q., Du S.Y. Investigation on application of phase change thermal control in electronic devices. Chin J Electron Dev 2007, 30(5):1939-1942. [in Chinese].
7. Tan F.L., Tso C.P. Cooling of mobile electronic devices using phase change materials. Appl Therm Eng 2004, 24:159-169.
8. Yoo D., Joshi Y. Energy efficient thermal management of electronic components using solid-liquid phase change materials. IEEE Trans Dev Mater Reliab 2004, 4(4):641-649.
9. Alawadhi E.M., Amon C.H. PCM thermal control unit for portable electronic devices: experimental and numerical studies. IEEE Trans Compon Pack Technol 2003, 26(1):116-125.
10. Price D.C. A review of selected thermal management solutions electronics for military systems. IEEE Trans Compon Pack Technol 2003, 26(1):26-39.
11. Zhang Z.G. Functional composite materials 2004, Chemical Industry Press, Beijing, [in Chinese].
12. Xiao M., Feng B., Gong K.C. Preparation and performance of shape stabilized phase change thermal storage materials with high thermal conductivity. Energy Convers Manage 2002, 43:103-108.
13. Jia W., Tchoudakov R., Narkis M., Siegmann A. Performance of expanded graphite and expanded milled-graphite fillers in thermosetting resins. Polym Compos 2005, 26:526-533.