Effect of melt convection on the optimum thermal design of heat sinks with phase change material

Journal of Enhanced Heat Transfer

Volumn 18, Issue 3, 2011, Pages 249-259

  Saha, S K ^a   Dutta, P ^a  

^a INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Electronics cooling; Genetic algorithm; Melt convection; Optimization; Phase change materials

Indexed keywords

ALUMINUM PLATES; CFD MODELS; CONDUCTION HEAT TRANSFER; ELECTRONICS COOLING; FIN THICKNESS; FIN WIDTHS; GEOMETRICAL OPTIMIZATION; MELT CONVECTION; OPTIMIZED DESIGNS; OPTIMUM THERMAL DESIGN; PHASE CHANGE PROCESS; SINGLE DOMAINS;

DESIGN; ELECTRONIC COOLING; FINS (HEAT EXCHANGE); GENETIC ALGORITHMS; HEAT CONDUCTION; HEAT FLUX; OPTIMIZATION; PHASE CHANGE MATERIALS;

HEAT CONVECTION;

EID: 79957481978     PISSN: 10655131     EISSN: None     Source Type: Journal    
DOI: 10.1615/JEnhHeatTransf.v18.i3.60     Document Type: Article

References (15)

1. Akhilesh, R., Narasimhan, A., and Balaji, C., Method to improve geometry for heat transfer enhancement in PCM composite heat sinks, Int. J. Mass Heat Transfer, vol. 48, pp. 2759-2770, 2005. (Pubitemid 40572824)
2. Alawadhi, E. M. and Amon, C. H., Thermal analysis of a PCM thermal control unit for portable electronics devices: experimental and numerical analysis, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, 2002.
3. Bentilla, E.W., Sterrett, K. F., and Karre, L. E., Research and development study on thermal control by use of fusible materials, Northrop Space Laboratories, Control No. NAS 8-11163, NASA Document No. N66-26691, 1966.
4. Chebi, R., Rice, P. A., and Schwarz, J. A., Heat dissipation in micro-electronic systems using phase change materials with natural convection, Chem. Eng. Commun., vol. 69, pp. 1-12, 1988.
5. Nagose, A., Somani, A., Shrot, A., and Narasimhan, A., Genetic algorithm based optimization of PCM based heat sinks and effect of heat sink parameters on operational time, ASME J. Heat Transfer, vol. 130, pp. 011401, 2008.
6. Nayak, K. C., Saha, S. K., Srinivasan, K., and Dutta, P., A numerical model for heat sinks with phase change materials and thermal conductivity enhancers, Int. J. Mass Heat Transfer, vol. 49, pp. 1833-1844, 2006.
7. Pal, D. and Joshi, Y. K., Application of phase change materials to thermal control of electronics modules: A computational study, ASME J. Electron. Packaging, vol. 119, pp. 40-50, 1997. (Pubitemid 127448538)
8. Pal, D. and Joshi, Y. K., Thermal management of an avionics module using solid-liquid phase-change materials, J. Thermophys. Heat Transfer, vol. 12, no. 2, pp. 256-262, 1998. (Pubitemid 128655269)
9. Pal, D. and Joshi, Y. K., Melting in a side heated tall enclosure by a uniformly dissipating heat source, Int. J. Mass Heat Transfer, vol. 44, pp. 375-38, 2001.
10. Patankar, S. V., Numerical Heat Transfer and Fluid Flow, Hemisphere Publ., New York, 1980.
11. Saha, S. K., Srinivasan, K., and Dutta, P., Studies on optimum distribution of fins in heat sinks filled with phase change materials, ASME J. Heat Transfer, vol. 130, pp. 034505, 2008.
12. Shatikian, V., Ziskind, G., and Letan, R., Numerical investigation of a PCM-based heat sink with internal fins: Constant heat flux, Int. J. Heat Mass Transfer, vol. 51, pp. 1488-1493, 2008.
13. Witzman, S., Shitzer, A., and Zvirin, Y., Simplified calculation procedure of a latent heat reservoir for stabilizing the temperature of electronic devices, IN: Heat transfer in electronic equipment - 1983; Proceedings of the Symposium, Boston, MA, November 13-18, 1983. New York, American Society of Mechanical Engineers, pp. 29-34, 1983. (Pubitemid 14633926)
14. Zheng, N. andWirtz, R. A., A hybrid thermal energy storage device, Part 1: Design methodology, ASME J. Electron. Packaging, vol. 126, pp. 1-7, 2004a.
15. Zheng, N. and Wirtz, R. A., A hybrid thermal energy storage device, Part 2: Thermal performance figures of merit, ASME J. Electron. Packaging, vol. 126, pp. 8-13, 2004b.