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Volumn , Issue , 2008, Pages 255-258
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Microstructure study of high lead bump FCBGA bending test
b
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Author keywords
95Pb 5Snbump; Fatigue; Flip chip
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Indexed keywords
3-POINT BENDING;
95PB/5SNBUMP;
AGING CONDITIONS;
AGING TIME;
AREA REQUIREMENTS;
BACK-SCATTERED;
CERAMIC SUBSTRATES;
ELECTRICAL PERFORMANCE;
ENERGY-DISPERSIVE X-RAYS;
FATIGUE;
FLIP CHIP;
FLIP CHIP INTERCONNECTIONS;
FLIP CHIP TECHNOLOGIES;
HANDLING CAPABILITIES;
HEIGHT PROFILES;
HIGH MELTING;
HIGH TEMPERATURE STORAGE TESTS;
HIGH TEMPERATURES;
INPUT/OUTPUT;
INTERMETALLIC COMPOUND LAYERS;
INTERMETALLIC COMPOUNDS;
LOADING FORCES;
LOW MELTING;
MECHANICAL BENDING;
ORGANIC SUBSTRATES;
REFLOW PROCESS;
ROOT CAUSE OF FAILURES;
SEM;
SMALL CHIP SIZES;
SOLDER BUMPS;
SOLDER JOINT FATIGUES;
SOLDER JOINT MICROSTRUCTURES;
SOLDER MICROSTRUCTURES;
TEST ENVIRONMENTS;
THERMAL CYCLE TESTS;
WIRE BONDINGS;
BRAZING;
CHIP SCALE PACKAGES;
ELECTRIC BATTERIES;
ELECTRONIC EQUIPMENT MANUFACTURE;
FLIP CHIP DEVICES;
LEAD;
MICROSTRUCTURE;
MICROSYSTEMS;
PHASE INTERFACES;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTING INTERMETALLICS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
TECHNOLOGY;
TESTING;
TIN;
WELDING;
SUBSTRATES;
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EID: 64049107879
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2008.4783859 Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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