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Scripta Materialia

Volumn 65, Issue 5, 2011, Pages 388-391

Evaluation of local strain evolution from metallic whisker formation

(4) Sun, Yong a Hoffman, Elizabeth N b Lam, Poh Sang b Li, Xiaodong a

a University of South Carolina (United States)

b SAVANNAH RIVER NATIONAL LABORATORY (United States)

Author keywords

Coatings; Digital image correlation; Lead free solder; Metallic whiskers; Thin films

Indexed keywords

DIGITAL IMAGE CORRELATIONS; DYNAMIC GROWTH PROCESS; LEAD FREE SOLDERS; LOCAL STRAINS; METALLIC WHISKERS; PRINCIPAL STRAIN; SCANNING ELECTRON MICROSCOPY IMAGE; STRAIN FIELDS; STRAIN GRADIENTS; TIN FILMS; WHISKER FORMATION; WHISKER GROWTH;

CRYSTAL WHISKERS; IMAGE ANALYSIS; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT; TIN;

STRAIN;

EID: 79959943435 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2011.05.007 Document Type: Article

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.