Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

Acta Materialia

Volumn 61, Issue 7, 2013, Pages 2471-2480

  Marques, V M F ^a   Wunderle, B ^b   Johnston, C ^a   Grant, P S ^a  

^a UNIVERSITY OF OXFORD   (United Kingdom)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Aerospace applications; High temperature nanoindentation; Intermetallics; Lead free solders; Reliability

Indexed keywords

CREEP BEHAVIOUR; CREEPING MATERIALS; HIGH TEMPERATURE; LEAD FREE SOLDERS; NANOINDENTATION CREEPS; NANOMECHANICAL CHARACTERIZATION; TEMPERATURE RANGE; UNIAXIAL CREEP;

AEROSPACE APPLICATIONS; FINITE ELEMENT METHOD; INTERMETALLICS; MECHANICAL PROPERTIES; NANOINDENTATION; RELIABILITY; SILVER; SOLDERING ALLOYS; TIN;

CREEP;

EID: 84875230052     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2013.01.020     Document Type: Article

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