Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder

Electrochimica Acta

Volumn 90, Issue , 2013, Pages 265-273

  Goh, Yingxin ^a   Haseeb, A S M A ^a   Sabri, Mohd Faizul Mohd ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Additives; Electroplating; Lead free solder; Sn Bi eutectic alloy

Indexed keywords

CODEPOSITION; DEPOSITION POTENTIAL; ELECTROCHEMICAL BEHAVIORS; EUTECTIC ALLOYS; GRAIN-REFINING ADDITIVES; LEAD FREE SOLDERS; LOW TEMPERATURES; METHANE SULFONIC ACID; PB FREE SOLDERS; PLATING BATH; SN-BI ALLOY; SYNERGISTIC EFFECT;

ADDITIVES; DEPOSITS; ELECTROPLATING; LEAD; PHENOLS; TIN;

TIN ALLOYS;

EID: 84871912799     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2012.12.036     Document Type: Article

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