The effects of electroplating parameters on the composition and morphology of Sn-Ag solder

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1459-1464

  Kim, J Y ^a   Yu, J ^a   Lee, J H ^b   Lee, T Y ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hong Ik University   (South Korea)

^c Hanbat National University   (South Korea)

Author keywords

Duty cycle; Electroplating; Morphology; Pulse plating; Sn Ag solder; Surface active agent

Indexed keywords

ADDITIVES; CYANIDES; ELECTRODES; ENERGY DISPERSIVE SPECTROSCOPY; SILVER COMPOUNDS; SOLDERING; SURFACE ACTIVE AGENTS; TIN ALLOYS;

DUTY CYCLE; PULSE PLATING; SU-AG SOLDER;

ELECTROPLATING;

EID: 11344261886     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0087-9     Document Type: Conference Paper

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