Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Jakubowska, Małgorzata ^a,c   Bukat, Krystyna ^b   Kościelski, Marek ^b   Młozniak, Anna ^c   Niedźwiedź, Wojciech ^a   Słoma, Marcin ^a   Sitek, Janusz ^b  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^c ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GRAIN SIZE; NANO-MATERIALS; SAC-SOLDERS; SEM; SILVER NANOPARTICLES; SOLDER BALLS; SOLDER JOINTS; SOLDER PASTE; TECHNOLOGICAL PROPERTIES;

CARBON NANOTUBES; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOPARTICLES; NANOSTRUCTURED MATERIALS; SILVER; SOLDERING ALLOYS; X RAY SPECTROSCOPY;

SOLDERING;

EID: 78651279938     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642884     Document Type: Conference Paper

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