Carbon nanotube thermal pastes for improving thermal contacts

Journal of Electronic Materials

Volumn 36, Issue 9, 2007, Pages 1181-1187

  Xu, Yunsheng ^a,b   Leong, Chia Ken ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b J and J Mechanic   (Canada)

Author keywords

Carbon nanotube; Dispersion; Paste; Polymer; Thermal conductance; Thermal contact

Indexed keywords

CONFORMABILITY LOSS; HEXAGONAL BORON NITRIDE PARTICLES; THERMAL CONTACTS;

BORON NITRIDE; PARTICLES (PARTICULATE MATTER); POLYETHYLENE GLYCOLS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

CARBON NANOTUBES;

EID: 34548289947     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0188-3     Document Type: Article

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