Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package

Applied Thermal Engineering

Volumn 50, Issue 1, 2013, Pages 799-804

  Heo, Yu Jin ^a,b   Kim, Hyo Tae ^a   Kim, Kyung Jun ^a   Nahm, Sahn ^b   Yoon, Young Joon ^a   Kim, Jonghee ^a  

^a Korea Institute of Ceramic Engineering and Technology (KICET)   (South Korea)

^b Korea University   (South Korea)

Author keywords

Aerosol deposition; Aluminum nitride film; Heat transfer; Light emitting diode; Package

Indexed keywords

AEROSOL DEPOSITION; AEROSOL DEPOSITION METHOD; ALN; ALN CERAMIC; ALN FILMS; ALUMINA SUBSTRATES; ALUMINUM NITRIDE FILMS; ALUMINUM PLATES; CONVENTIONAL METALS; ENHANCED HEAT TRANSFER; HEAT TRANSFER CHARACTERISTICS; HIGH THERMAL CONDUCTIVITY; LED PACKAGING; LOW THERMAL CONDUCTIVITY; PACKAGE; PACKAGE MATERIALS; ROOM TEMPERATURE; ROOM TEMPERATURE DEPOSITION; THERMAL BONDING; THERMAL INTERFACE MATERIALS; THERMAL TRANSIENTS; THERMAL VIAS;

ALUMINA; ALUMINUM; ALUMINUM COATINGS; ALUMINUM NITRIDE; DEPOSITS; DIODES; EPOXY RESINS; HEAT TRANSFER; INTERFACES (MATERIALS); ORGANIC POLLUTANTS; RESPIRATORY MECHANICS; THERMAL CONDUCTIVITY; THICK FILMS;

LIGHT EMITTING DIODES;

EID: 84866534646     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.07.024     Document Type: Conference Paper

References (20)

1. A. Christensen, and S. Graham Thermal effects in packaging high power light emitting diode arrays Applied Thermal Engineering 29 2009 364 371
2. C.J. Weng Advanced thermal enhancement and management of LED packages International Communications in Heat and Mass Transfer 36 2009 245 248
3. T. Cheng, X.B. Luo, S. Huang, and S. Liu Thermal analysis and optimization of multiple LED packaging based on a general solution International Journal of Thermal Sciences 49 2010 196 201
4. M.Y. Tsai, C.H. Chen, C.S. Kang, C. Huang, and S. Liu Thermal measurements and analyses of low-cost high-power LED packages and their modules Microelectronics Reliability 2011 10.1016/j.microel.2011.04.008
5. K.C. Yung, H. Liem, H.S. Choy, and W.K. Lun Thermal performance of high brightness LED array package on PCB International Communications in Heat and Mass Transfer 37 2010 1266 1272
6. J.S. Li, Q.X. Yang, P.J. Niu, L. Jin, B. Meng, Y. Li, Z.X. Xiao, and X. Zhang Analysis of thermal field on integrated LED light source based on COMSOL multi-physics finite element simulation Physics Procedia 22 2011 150 156
7. B.H. Liou, C.H. Chen, R.H. Horng, Y.C. Chiang, and D.S. Wuu Improvement of thermal management of high-power GaN-based light- emitting diodes Microelectronics Reliability 2011 10.1016/j.microel.2011.04.002
8. J.K. Sim, K. Ashok, Y.H. Ra, H.C. Im, B.J. Baek, and C.R. Lee Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package Current Applied Physics 12 2012 494 498
9. 3 additions on the crystallization mechanism and properties of diopside/anorthite hybrid glass-ceramics for LED packaging materials Journal of Crystal Growth 326 2011 124 127
10. W. Zhou, S. Qi, H. Li, and S. Shao Study on insulating thermal conductive BN/HDPE composites Thermochimica Acta 452 2007 36 42
11. L. Kim, J.H. Choi, S.H. Jang, and M.W. Shin Thermal analysis of LED array system with heat pipe Thermochimica Acta 455 2007 21 25
12. X.Y. Lu, T.C. Hua, and Y.P. Wang Thermal analysis of high power LED package with heat pipe heat sink Microelectronics Journal 42 2011 1257 1262
13. Z.M. Wan, J. Liu, K.L. Su, X.H. Hu, and S.S. M Flow and heat transfer in porous micro heat sink for thermal management of high power LEDs Microelectronics Journal 42 2011 632 637
14. S. Liu, J.H. Yang, Z.Y. Gan, and X.B. Luo Structural optimization of a microjet based cooling system for high power LEDs International Journal of Thermal Sciences 47 2008 1086 1095
15. P. Anithambigai, K. Dinashi, D. Mutharasu, S. Shanmugan, and C.K. Lim Thermal analysis of power LED employing dual interface method and water flow as a cooling system Thermochimica Acta 523 2011 237 244
16. H.W. Shin, H.S. Lee, J.H. Bang, S.H. Yoo, S.B. Jung, and K.D. Kim Variation of thermal resistance of LED module embedded by thermal via Journal of the Microelectronics & Packaging Society 17 4 2010 95 100
17. Y. Imanaka, N. Hayashi, M. Takenouchi, and J. Akedo Aerosol deposition for post LTCC Journal European Ceramic Society 27 2007 2789 2795
18. H. Cho, and H.J. Kim Metal-core printed circuit board with alumina layer by aerosol deposition process IEEE Electron Device Letters 29 9 2008 991 993
19. S. Liu, and X.B. Luo LED Packaging for Lighting Applications: Design, Manufacturing and Testing 2011 Wiley and Chemical Industry Press 978-0-470-82783-3
20. P. Mottier LEDs for Lighting Applications 2008 Wiley 978-1-84821-145-2