Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

International Journal of Thermal Sciences

Volumn 49, Issue 1, 2010, Pages 196-201

  Cheng, Ting ^a   Luo, Xiaobing ^a,b   Huang, Suyi ^a   Liu, Sheng ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Analytical solution; LEDs; Thermal spreading resistance

Indexed keywords

ANALYTICAL METHOD; ANALYTICAL SOLUTIONS; CHIP PACKAGING; GENERAL ANALYTICAL SOLUTION; HEAT SOURCES; HIGHEST TEMPERATURE; LED PACKAGING; METHOD OF VARIABLE SEPARATION; NUMERICAL RESULTS; SPREADING RESISTANCE; TARGET FUNCTIONS; TEMPERATURE DIFFERENCES; TEMPERATURE FIELD; THERMAL ANALYSIS; THERMAL PERFORMANCE; THERMAL SPREADING;

PACKAGING; STREET LIGHTING; SUBSTRATES; THERMOANALYSIS;

CHIP SCALE PACKAGES;

EID: 71849109588     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2009.07.010     Document Type: Article

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