Metal-core printed circuit board with alumina layer by aerosol deposition process

IEEE Electron Device Letters

Volumn 29, Issue 9, 2008, Pages 991-993

  Cho, Hyun Min ^a   Kim, Hyeong Joon ^b  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Aerosol deposition (AD); Dielectric films; Light emitting diodes (LEDs); Metal core printed circuit board (MCPCB); Thermal resistance

Indexed keywords

ABS RESINS; AEROSOLS; ALUMINA; ATMOSPHERIC AEROSOLS; BIOMECHANICS; CARBON FIBER REINFORCED PLASTICS; CERAMIC MATERIALS; CONDUCTING POLYMERS; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; HEAT RESISTANCE; LEAKAGE CURRENTS; LIGHT EMITTING DIODES; OPTICAL FILMS; ORE TREATMENT; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RESPIRATORY MECHANICS; THERMOELECTRICITY; THICK FILMS; THIN FILMS; TRANSIENT ANALYSIS;

AEROSOL DEPOSITION (AD); DIELECTRIC FILMS; LIGHT-EMITTING DIODES (LEDS); METAL-CORE PRINTED CIRCUIT BOARD (MCPCB); THERMAL RESISTANCE;

PRINTED CIRCUIT BOARDS;

EID: 50649121112     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2008.2001633     Document Type: Article

References (6)

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