Thermal analysis of high power LED package with heat pipe heat sink

Microelectronics Journal

Volumn 42, Issue 11, 2011, Pages 1257-1262

  Lu, Xiang You ^a,b   Hua, Tse Chao ^b   Wang, Yan Ping ^a  

^a ANHUI JIANZHU UNIVERSITY   (China)

^b UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY   (China)

Author keywords

Heat pipe; High power LED; Junction temperature; Thermal resistance

Indexed keywords

COOLING DEVICES; FILLING RATE; FLAT HEAT PIPE; HEAT RELEASE; HEAT TRANSFER PERFORMANCE; HIGH POWER LED; INCLINATION ANGLES; INPUT POWER; JUNCTION TEMPERATURES; PIPE-COOLING SYSTEMS; TEMPERATURE UNIFORMITY; THERMAL CHARACTERISTICS;

HEAT PIPES; HEAT RESISTANCE; HEAT SINKS; THERMOANALYSIS;

LIGHT EMITTING DIODES;

EID: 80053571875     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2011.08.009     Document Type: Article

References (14)

1. M.W. Shin Thermal design of high-power LED package and system Proc. SPIE 6355 2006 9 21
2. L.Q. Yang, S. Jang, W.-J. Hwang, and M.-W. Shin Thermal analysis of high power GaN-based LEDs with ceramic package Thermochim. Acta 455 2007 95 99
3. M. Arik, J. Prtroski, S. Weaver, Thermal challenges in the future generation solid state lighting applications: light emitting diodes, in: Proceedings of the ASME/1EEE International Packaging Technical Conference, Hawaii, 2001.
4. M. Arik, and S. Weaver Chip scale thermal management of high brightness LED packages Proc. SPIE 5530 2004 214 223 (Pubitemid 40416327)
5. E. Hong, and N. Narendran A method for projecting useful life of LED lighting systems Proc. SPIE 5187 2004 93 99
6. Y. Gu, and N. Narendran A non-contact method for determining junction temperature of phosphor-convened white LEDs Proc. SPIE 5187 2004 107 114
7. H.H. Kim, S.H. Choi, and S.H. Shin Thermal transient characteristics of die attach in high power LED PKG Microelectron. Reliab. 48 2008 444 545
8. A. Christensen, and S. Graham Thermal effects in packaging high power light emitting diode arrays Applied Therm. Eng. 29 23 2009 364 371
9. Y. Lai, N. Cordero, and F. Barthel Liquid cooling of bright LEDs for automotive applications Appl. Therm. Eng. 29 56 2009 1239 1244
10. B.J. Huang, C.W. Tang, and M.S. Wu System dynamics model of high-power LED luminaire Appl. Therm. Eng. 29 4 2009 609 616
11. S. Kubota, A. Taguchi, and K. Yazawa Thermal challenges deriving from the advances of display technologies Microelectron. J. 39 7 2008 942 949 (Pubitemid 351778424)
12. J.Z. Hu, L.Q. Yang, and M.W. Shin Mechanism and thermal effect of delamination in light-emitting diode packages Microelectron. J. 38 2 2007 157 163
13. G.J. Sheu, F.S. Hwu, and S.H. Tu The heat dissipation performance of LED applied a MHP Proc. SPIE 5941 2005 13 20
14. L. Kim, J.H. Choi, and S.H. Jang Thermal analysis of LED array system with heat pipe Thermochim. Acta 455 2007 21 25