Thermal measurements and analyses of low-cost high-power LED packages and their modules

Microelectronics Reliability

Volumn 52, Issue 5, 2012, Pages 845-854

  Tsai, M Y ^a   Chen, C H ^a   Kang, C S ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM SUBSTRATE; COMMERCIAL FINITE ELEMENT CODES; COMMERCIAL PACKAGES; COMPUTATIONAL FLUID DYNAMICS CODES; CONVECTION COEFFICIENTS; DESIGN PARAMETERS; EXPERIMENTAL MEASUREMENTS; FLOW CONDITION; HIGH POWER LED; HIGH-POWER; JUNCTION TEMPERATURES; LIGHT EMITTING DIODE (LED); NATURAL AND FORCED CONVECTIONS; PARAMETRIC STUDY; THERMAL BEHAVIORS; THERMAL IMAGERS; THERMAL MEASUREMENTS;

COMPUTATIONAL FLUID DYNAMICS; FINITE ELEMENT METHOD; HEAT RESISTANCE; THERMOANALYSIS; THERMOCOUPLES; THREE DIMENSIONAL;

LIGHT EMITTING DIODES;

EID: 84860353299     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.04.008     Document Type: Article

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