Proof of damage-free selective removal of thin dielectric coatings on silicon wafers by irradiation with femtosecond laser pulses

Journal of Applied Physics

Volumn 112, Issue 2, 2012, Pages

  Rublack, Tino ^a   Schade, Martin ^a   Muchow, Markus ^a   Leipner, Hartmut S ^a   Seifert, Gerhard ^a,b  

^a MARTIN LUTHER UNIVERSITY HALLE WITTENBERG   (Germany)

^b FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DAMAGE-FREE; FS LASER PULSE; FS PULSE; LASER FLUENCES; MICRO-STRUCTURAL; SELECTIVE REMOVAL; STRUCTURAL MODIFICATIONS; THIN DIELECTRIC COATINGS; THIN DIELECTRIC FILM; THIN DIELECTRIC LAYER; THIN FILM ABLATION; THIN LAYERS;

DIELECTRIC FILMS; TRANSMISSION ELECTRON MICROSCOPY; ULTRAFAST LASERS; ULTRASHORT PULSES;

SILICON WAFERS;

EID: 84865527642     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4739305     Document Type: Article

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